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201
Design and investigation of air-cooled heat sinks using 3D printing technology
Published 2016“…This study presents the heat transfer performance of five pin fin heat sinks that have been fabricated using Selective Laser Melting. …”
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Final Year Project (FYP) -
202
Design of wideband low-loss reconfigurable reflectarray antenna
Published 2024“…This RRA design, integrated with PIN diodes, achieves a working bandwidth of 16% from 1.7 to 2.0 GHz, fully covering the design bandwidth requirements of the L-band, with a phase difference of 180°±10° within the working bandwidth and an insertion loss of less than 0.3 dB.…”
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Thesis-Master by Coursework -
203
Physics-Informed Deep Learning for Plasma Etch Optimization
Published 2024“…In this thesis, we share our findings for plasma etch recipe optimization using AI and ML. …”
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Thesis -
204
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205
Challenges faced by women in the corporate world
Published 2008Get full text
Final Year Project (FYP) -
206
Comparative study of accounting standards between Singapore and the Peoples' Republic of China
Published 2008Get full text
Final Year Project (FYP) -
207
Convective boiling and condensation in enhanced tubes produced by selective laser melting
Published 2018“…The design of the four tubes are five long circumferential pin fins, eight short circumferential pin fins, twisted pin fins and a metallic foam structure. …”
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Final Year Project (FYP) -
208
A two-dimensional co-rotational Timoshenko beam element with XFEM formulation
Published 2014“…Pin connections and plastic hinges produce non-smooth displacement fields in beam structures. …”
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Journal Article -
209
Study of heat transfer through micro-structured surfaces
Published 2016“…Each chip has a different microstructure in the form of very small and elongated pin-fins, which will in turn affect the critical heat flux of each component. …”
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Final Year Project (FYP) -
210
NTU e-bike
Published 2011“…This project aims to develop a GPS application showing the current location and speed of an E-bike as well as a route find function between two locations in NTU. In the report, there will be an overview of the Android system and the hardware used in this project. …”
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Final Year Project (FYP) -
211
Development of optical transceiver
Published 2010“…For PIN photodiodes, the epitaxial layer was introduced to the structures to act as an intrinsic layer. …”
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Final Year Project (FYP) -
212
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213
A 1-bit 16×16 reconfigurable intelligent surfaces array for C-band
Published 2025“…RIS array is achieved by combining a number of basic elements together with PIN diodes which control the on and off state of RIS units. …”
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Thesis-Master by Coursework -
214
Conditional conservatism and debt versus equity financing
Published 2019“…We also find that the reduction in cost of equity associated with conservatism is greater for equity issuers than for debt issuers, but find no such difference when we examine cost of debt. …”
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Journal Article -
215
Automatic test chip set
Published 2008“…In this project, the fundamental functions and basic circuitry of an universal pin electronics are investigated and designed.…”
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Research Report -
216
Experimental studies of melting PCM in a heat sink
Published 2011“…This project presents the experimental studies and findings of melting phase change material in a heat sink. …”
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Final Year Project (FYP) -
217
Behind every domain there is a shift: adapting distortion-aware vision transformers for panoramic semantic segmentation
Published 2024“…Third, aside from Pinhole-to-Panoramic ( Pin2Pan ) adaptation, we create a new dataset (SynPASS) with 9,080 panoramic images, facilitating Synthetic-to-Real ( Syn2Real ) adaptation scheme in 360∘ imagery. …”
Journal article -
218
The effects of processing conditions on the morphology of single conjugated polymers.
Published 2010“…The photoluminescent lifetime of spun-cast single regioregular poly (3-hexylthiophene) (RR P3HT) was found to be significantly larger (2 – 3.5ns) than that of drop-cast chains and that in solution (<0.5ns), which likely implies a chain conformational dependence on the processing method used. …”
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Final Year Project (FYP) -
219
Two-phase immersion cooling for power dense printed circuit board converters
Published 2024“…A theoretical model and numerical solution method for boiling on pin fins is developed and used to design heat spreaders to increase the power dissipation per unit semiconductor area with minimal penalty on the converter volume. …”
Thesis -
220
A Singapore perspective : impact of disclosure and board independence on firm performance.
Published 2010“…Interestingly, firms that have more than 50% independent directors on their boards do not have better performance. …”
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Final Year Project (FYP)