Temperature and stress distribution in the SOI structure during fabrication by Tan, Cher Ming, Gan, Zhenghao, Gao, Xiaofang

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Toroidal surface measurement with elliptical lenslet array by Guo, Wenjiang, Zhao, Liping, Chen, I-Ming

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More with less by Lim, Amanda Jane Yi Kuan, Lim,Aronn Chong Leong, Peh, Gina Ying Ying, Puah, Kevyn Pin Xuan

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Membrane distillation hybridized with a thermoelectric heat pump for energy-efficient water treatment and space cooling by Tan, Yong Zen, Han, Le, Chew, Nick Guan Pin, Chow, Wai Hoong, Wang, Rong, Chew, Jia Wei

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Amidinato Isopropylmethylamidosilylene-catalyzed hydroboration of carbonyl compounds by Lee, Jiawen, Fan, Jun, Koh, An-Ping, Cheang, Joslyn Wan-Jun, Yang, Ming-Chung, Su, Ming-Der, So, Cheuk-Wai

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Electrophoretic deposition of reduced graphene oxide thin films for reduction of cross-sectional heat diffusion in glass windows by Yeo, Loo Pin, Nguyen, Tam Duy, Ling, Han, Lee, Ying, Mandler, Daniel, Magdassi, Shlomo, Tok, Alfred Iing Yoong

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Study on mechanical behaviors of cable-supported ribbed beam composite slab structure during construction phase by Qiao, W. T., Zhao, Ming Shan, An, Q., Wang, D.

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Integrated marketing communication campaign for Goodwood Park Hotel. by Thiang, Joy Yen Ping., Yong, Annie Ming Sy.

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Mechanical properties and deformation behaviour of early age concrete in the context of digital construction by Panda, Biranchi, Lim, Jian Hui, Tan, Ming Jen

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Intelligence operations : risks faced by academia by Loh, Dylan Ming Hui, Ho, Benjamin Tze Ern

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Plastic Instability in Co-Cr-Ni-Mo alloy wires drawn with different drawing practices by GVK, Sai Srikanth, Tan, Ming Jen, Liu, Zhenyun

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Estate planning In Singapore. by Tan, Ming Eng., Cheong, Kwok Seng., Wang, Xunshi.

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Deep robust multilevel semantic hashing for multi-label cross-modal retrieval by Song, Ge, Tan, Xiaoyang, Zhao, Jun, Yang, Ming

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Evaluation of the level of corporate disclosure of listed companies in Singapore by Huang, Ming Hong, Zhang, Jie, Zhu, Cui Wei

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The call to complain : antecedents to complaint behaviour (telecommunications industry). by Lim, An Qi., Ng, Shi Hui., Tan, Ming Hui.

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Superplasticity and forming of advanced materials by Tan, Ming Jen., Liew, Kim Meow., Thiruvarudchelvan, Sinnathamby.

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Tensile Behavior of High Performance Structural Steel T-stub Joints by Zhao, Ming Shan, Lee, C. K., Chiew, S. P.

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A Review of 3D Printable Construction Materials and Applications by Tan, Ming Jen, Lu, Bing, Qian, Shun Zhi

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Potential biological control agents of Geosmithia morbida restrict fungal pathogen growth via mycoparasitism and antibiosis by Onufrak, Aaron J., Gazis, Romina, Gwinn, Kimberly, Klingeman, William, Khodaei, Sima, Perez Oñate, Luis I., Finnell, Autumn, Givens, Spencer, Chen, Cristine, Holdridge, David R., Hadziabdic, Denita

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Structural changes in the silver-carbon composite anode interlayer of solid-state batteries by Spencer-Jolly, D, Agarwal, V, Doerrer, C, Hu, B, Zhang, S, Melvin, DLR, Gao, H, Gao, X, Adamson, P, Magdysyuk, OV, Grant, PS, House, RA, Bruce, PG