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421
3D simulation-based research on the effect of interconnect structures on circuit reliability
Published 2015“…The simulation of the EM reliability of the interconnects is usually performed using the line-via structure at the EM test temperature (e.g. 300 oC).However, such simulation using the line-via structure may not give the same void nucleation location as in the real circuit structure, especially at the circuit operation temperature (e.g. 90C). …”
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Journal Article -
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Degradation model of a linear-mode LED driver and its application in lifetime prediction
Published 2015Get full text
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Journal Article -
426
Localization and velocity tracking of human via 3 IMU sensors
Published 2016Get full text
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Journal Article -
427
Excitonic properties of graphene-based materials
Published 2013Get full text
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Journal Article -
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Toroidal surface measurement with elliptical lenslet array
Published 2013Get full text
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Conference Paper -
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Diboron-carbene complexes derived from a geminal dianion
Published 2022Get full text
Journal Article -
434
Measurement and calibration of a six-axis reconfigurable parallel robot system
Published 2008“…A modular reconfigurable parallel robot system consists of standardized links and joint components that can be assembled into a particular geometry for specific tasks. …”
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Research Report -
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