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pinna » pina (Expand Search), pinga (Expand Search), pinaa (Expand Search), pinka (Expand Search), pingna (Expand Search), spinna (Expand Search)
inch » inc (Expand Search)
sfive » five (Expand Search), sive (Expand Search), afive (Expand Search)
fine » find (Expand Search), line (Expand Search), five (Expand Search)
pinn » ping (Expand Search), pina (Expand Search), pink (Expand Search), pingn (Expand Search), spinn (Expand Search)
pinga » pingat (Expand Search), pingao (Expand Search), ping (Expand Search), pingga (Expand Search), spinga (Expand Search)
pingna » pinggna (Expand Search), spingna (Expand Search)
pin » ping (Expand Search), spin (Expand Search)
ming » min (Expand Search), ling (Expand Search)
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601
Fabrication of heat sinks by Selective Laser Melting for convective heat transfer applications
Published 2021“…Three heat sinks comprising pin fins of circular, rectangular-rounded and aerofoil geometries were fabricated by SLM from aluminium alloy AlSi10Mg powder. …”
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Journal Article -
602
Comparative study of accounting standards between Singapore and the Peoples' Republic of China
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Final Year Project (FYP) -
603
Convective boiling and condensation in enhanced tubes produced by selective laser melting
Published 2018“…The design of the four tubes are five long circumferential pin fins, eight short circumferential pin fins, twisted pin fins and a metallic foam structure. …”
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Final Year Project (FYP) -
604
A two-dimensional co-rotational Timoshenko beam element with XFEM formulation
Published 2014“…Pin connections and plastic hinges produce non-smooth displacement fields in beam structures. …”
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Journal Article -
605
Study of heat transfer through micro-structured surfaces
Published 2016“…Each chip has a different microstructure in the form of very small and elongated pin-fins, which will in turn affect the critical heat flux of each component. …”
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Final Year Project (FYP) -
606
Germanium-on-insulator for group IV laser and III-V integration on silicon
Published 2018“…Then the Ge/Si wafer was bonded to an 8 inch Si (001) wafer with a bonding dielectric layer to form a GOI structure. …”
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Thesis-Doctor of Philosophy -
607
Design of wideband low-loss reconfigurable reflectarray antenna
Published 2024“…It proposes an RRA design that integrates a PIN diode with air gap. The switch of the reconfigurable unit is directly mounted on the reflective element, reducing the loss introduced by the switching device. …”
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Thesis-Master by Coursework -
608
Development of optical transceiver
Published 2010“…For PIN photodiodes, the epitaxial layer was introduced to the structures to act as an intrinsic layer. …”
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Final Year Project (FYP) -
609
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610
Viscoelastic material characterization and novel damper development for sound proof HDD
Published 2009“…Therefore in an attempt to reduce the acoustic noise level of a 1.8 inch HDD, experimental and numerical study is carried out in this report to develop a novel HDD cover with viscoelastic damper. …”
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Final Year Project (FYP) -
611
Automatic test chip set
Published 2008“…In this project, the fundamental functions and basic circuitry of an universal pin electronics are investigated and designed.…”
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Research Report -
612
Modeling distance-dependent individual head-related transfer functions in the horizontal plane using frontal projection headphones
Published 2016“…Soc. 61, 989–1000] project the sound directly onto the pinnae from the front, and thus inherently create listener's idiosyncratic pinna cues at the eardrum. …”
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Journal Article -
613
A 1-bit 16×16 reconfigurable intelligent surfaces array for C-band
Published 2025“…RIS array is achieved by combining a number of basic elements together with PIN diodes which control the on and off state of RIS units. …”
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Thesis-Master by Coursework -
614
Behind every domain there is a shift: adapting distortion-aware vision transformers for panoramic semantic segmentation
Published 2024“…Third, aside from Pinhole-to-Panoramic ( Pin2Pan ) adaptation, we create a new dataset (SynPASS) with 9,080 panoramic images, facilitating Synthetic-to-Real ( Syn2Real ) adaptation scheme in 360∘ imagery. …”
Journal article -
615
Experimental studies of melting PCM in a heat sink
Published 2011“…The heat sink design that was the focus of this study is based on the pin finned heat sink design. Experiments mainly pertaining to the characteristics of the melting PCM in the heat sinks were observed and recorded to further understand the behaviours and characteristics of the melting PCM. …”
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Final Year Project (FYP) -
616
Hybrid biometric authentication for automatic teller machine
Published 2024“…Unlike traditional password or PIN-based methods, biometric authentication uses unique physical characteristics, such as fingerprints, to verify identity. …”
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Article -
617
SnO2 nanorod arrays : low temperature growth, surface modification and field emission properties
Published 2013“…SnO2 nanorod arrays have been deposited on 4 inch SiO2/Si and Si wafers and stainless steel substrates by plasma-enhanced chemical vapor deposition without any high temperature treatment or additional catalysis. …”
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Journal Article -
618
Design of a dual band planar inverted-F antenna for GMS/DCS mobile handset
Published 2008“…This project involved the study of size miniaturization of microstrip antenna techniques: shorting pin and shorting wall, loading, shorted spiral printed antenna and stacked shorted patch antenna are fully discussed.…”
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Thesis -
619
Study on the wear characteristics of aluminium metal matrix composite with 15% Al2O3 and 20% Al2O3
Published 2008“…The objective of this dissertation was to study the wear characteristics and behaviour of aluminium metal matrix composite materials (MMCs), namely Duralcan 286 and Duralcan 284 as a pin material when mated against three types of dics materials.…”
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Thesis -
620
Effect of hydrophobic soils on infiltration
Published 2020“…The fine sand layer was then replaced by hydrophobic fine sand to study the effect of hydrophobicity on the infiltration. …”
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Final Year Project (FYP)