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Study of heat transfer through micro-structured surfaces
Published 2016“…Each chip has a different microstructure in the form of very small and elongated pin-fins, which will in turn affect the critical heat flux of each component. …”
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Final Year Project (FYP) -
183
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184
Determinants of health-related quality of life after out-of-hospital cardiac arrest (OHCA): a systematic review
Published 2023Get full text
Journal Article -
185
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186
Web-based interactive graph visualization
Published 2018“…By the end of the project, a prototype of the website will be developed with basic analysis functions implemented and continuation of this project is to be expected therefore, the website will be built with extensibility in mind. Improvements, like additional clustering methods, ways to differentiate data through colour coding and further optimizing the algorithm can be implemented in the near future.…”
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Final Year Project (FYP) -
187
Design of optical building blocks for photonic integration
Published 2008“…Defect states within the photonic bandgaps behave like either donor or acceptor modes similar to other photonic crystals. …”
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Research Report -
188
Solar air conditioning using adsorption cooling II
Published 2011“…The hardware design includes like the circuit design and layout of the system controller; and the programming part which comprises the writing of program and the use of compilers for microcontroller. …”
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Final Year Project (FYP) -
189
Federated learning for edge computing
Published 2024“…I will test these models’ using data from a variety of sources to ensure they operate well in real-world scenarios while maintaining people's privacy. Second, I would like to understand more about the unique characteristics of decentralized datasets. …”
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Final Year Project (FYP) -
190
Anisotropic conductive adhesive for micro joining in semiconductor interconnects application (solder alternative for fine pitch & environment friendly IC packaging)
Published 2008“…The development of anisotropic and isotropic conductive adhesives (ACA & ICA respectively) as an alternative to solder bumps has received extensive attention in flip chip packaging as it offers an array of advantages like finer pitch interconnects, green processes, low cost, and low temperature processing. …”
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Thesis -
191
Crowd estimation in images
Published 2023“…Although these technologies are novel and revolutionary, factors like occlusion and scale variation remain a constant challenge to these crowd counting architectures. …”
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Final Year Project (FYP) -
192
Charge modulation spectroscopy of solution-processable field-effect transistors
Published 2017“…Our results lay down the path for developing mathematical device models as well as optimizing the molecular design of organic and hybrid organic-inorganic semiconductors for the development of high-performance, solution-processable FETs, as well as high brightness light-emitting devices like gated light-emitting diodes and electrical injection lasers.…”
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Thesis -
193
Vulnerability of port of Singapore as a maritime hub due to impact of international trade affairs
Published 2019“…Since 1819, Singapore has been involved in the seaborne trade and has been known as a maritime hub providing services like bunkering, crew changes and petrochemical refinery. …”
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Final Year Project (FYP) -
194
Development of an application to improve mental health (A)
Published 2023“…Generally, most of these applications present features that offer ways to stay engaged with the user, like daily reminders, feelings trackers, abundant learning materials, and search for therapists and treatments via the apps. …”
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Final Year Project (FYP) -
195
4D printable thermally stimulated (meth)acrylate shape memory polymers with tailorable shape recovery force for vat photopolymerization
Published 2025“…This enables the SMP to recover back to its original shape by itself, just like most elastomers. The most common additive manufacturing technology to 4D print these SMPs is vat photopolymerization. …”
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Thesis-Doctor of Philosophy -
196
Determinants of voluntary financial disclosure by Singapore firms in comparison to U.S. firms
Published 2008Get full text
Final Year Project (FYP) -
197
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198
The moderating effect of team familiarity and similarity on virtuality and conflict in teams
Published 2010Get full text
Final Year Project (FYP) -
199
Software industry in Singapore : Characteristics and alliances.
Published 2014Get full text
Final Year Project (FYP) -
200
Foreign talent : antecedents and consequences of underemployment.
Published 2008Get full text
Final Year Project (FYP)