Debonding of bonded composite joints with TEP modified epoxy adhesives by Caglar, Hasan, Sridhar, Idapalapati, Sharma, Mohit, Chian, Kerm Sin

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Rapid defect detections of bonded wafer using near infrared polariscope by Asundi, Anand Krishna, Ng, Chi Seng

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Analysis and design recommendations for structures strengthened by prestressed bonded Fe-SMA by Li, Lingzhen, Wang, Sizhe, Chatzi, Eleni, Motavalli, Masoud, Ghafoori, Elyas

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Hydrogen-bond memory and water-skin supersolidity resolving the Mpemba paradox by Zhang, Xi, Huang, Yongli, Ma, Zengsheng, Zhou, Yichun, Zhou, Ji, Zheng, Weitao, Jiang, Qing, Sun, Changqing

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Molecular dynamics and simulations study on the vibrational and electronic solvatochromism of benzophenone by Kumar, Venkatraman Ravi, Verma, Chandra, Umapathy, Siva

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Thermal shock resistance enhancement by improved interfacial bonding for carbon/aluminium composites by Wei, Wenfu, Huang, Zhanglin, Yin, Guofeng, Yang, Zefeng, Li, Xiaobo, Zuo, Haozi, Deng, Qin, Huang, Guizao, Ren, Junwen, Liao, Qianhua, Yang, Yan, Wu, Guangning

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Hydrogen bond and surface stress relaxation by aldehydic and formic acidic molecular solvation by Chen, Jiasheng, Yao, Chuang, Zhang, Xi, Sun, Chang Q., Huang, Yongli

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Understanding the bonding mechanisms of directly sputtered copper thin film on an alumina substrate by Lim, Ju Dy, Lee, Pui Mun, Chen, Zhong

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Effect of chain length on low temperature gold-gold bonding by self assembled monolayers by Ang, X. F., Chen, Z., Wong, Chee C., Wei, J.

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Experimental characterization and modeling of the mechanical properties of Cu–Cu thermocompression bonds for three-dimensional integrated circuits by Made, Riko I., Thompson, Carl V., Gan, Chee Lip, Yan, Li Ling, Kor, Katherine Hwee Boon, Chia, Hong Ling, Pey, Kin Leong

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Pyridine N-oxide catalyzed living radical polymerization of methacrylates via halogen bonding catalysis by Xu, Haiyan, Wang, Chen-Gang, Lu, Yunpeng, Goto, Atsushi

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Synthesis of a germylidenide anion from the C-C bond activation of a bis(germylene) by Seow, Celestine, Xi, Hong-Wei, Li, Yongxin, So, Cheuk-Wai

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A three-membered diazo-aluminum heterocycle to access an Al=C π bonding species by Yan, Chenting, Kinjo, Rei

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Oxytocin receptor gene and parental bonding modulate prefrontal responses to cries : a NIRS study by Cataldo, Ilaria, Neoh, Michelle Jin-Yee, Chew, Wei Fang, Foo, Jia Nee, Lepri, Bruno, Esposito, Gianluca

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The role of free volume, hydrogen bonding, and crosslinks on physical aging in polymers of intrinsic microporosity (PIMs) by Joo, Taigyu, Rodriguez, Katherine Mizrahi, Lee, Hyunhee, Acharya, Durga, Doherty, Cara M., Smith, Zachary P.

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A highly strained Al-Al σ-bond in dianionic aluminum analog of oxirane for molecule activation by Koshino, Kota, Kinjo, Rei

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Effect of prebonding anneal on the microstructure evolution and Cu–Cu diffusion bonding quality for three-dimensional integration by Peng, L., Zhang, L., Li, H.Y., Lim, Dau Fatt, Tan, Chuan Seng

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Recalled parental bonding interacts with oxytocin receptor gene polymorphism in modulating anxiety and avoidance in adult relationships by Cataldo, Ilaria, Bonassi, Andrea, Lepri, Bruno, Foo, Jia Nee, Setoh, Peipei, Esposito, Gianluca

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A flat carborane with multiple aromaticity beyond Wade–Mingos’ rules by Lu, Wei, Do, Dinh Cao Huan, Kinjo, Rei

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The effect of bonding structure of diamond like carbon (DLC) film with surface nickel coating upon laser annealing by Xu, Naiyun, Tsang, Siu Hon, Tan, Chong Wei, Teo, Hang Tong, Wang, Xincai, Tay, Beng Kang

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