Forced convection and sub-cooled flow boiling heat transfer from electronic chips by Tou, Kwok Woon., Tso, Chih Ping.

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3D Printing for Marketing and Advertisement Industry by Wu, Wenjin, Tor, Shu Beng

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Investigating the relationship between speaking fundamental frequency and acoustic vowel space size by Tseng, Felicia Hui Juan

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Digital curation for cultural and intellectual assets : a Taiwan perspective by Ke, Hao-Ren, Tseng, Shu-Hsien

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Comparison of Two Metallic Additive Manufacturing Technologies: Selective Laser Melting and Electron Beam Melting by Kok, Yihong, Tor, Shu Beng, Loh, Ngiap Hiang

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Design of AlN-based micro-channel heat sink in direct bond copper for power electronics packaging by Yin, Shan, Tseng, King Jet, Zhao, Jiyun

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Thermal-mechanical design of sandwich SiC power module with micro-channel cooling by Yin, Shan, Tseng, King Jet, Zhao, Jiyun

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Machine learning in additive manufacturing : state-of-the-art and perspectives by Wang, Chengcheng, Tan, Xipeng, Tor, Shu Beng, Lim, C.S.

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Nonhomogeneous-nonequilibrium two-phase-flow model for nuclear reactor single-channel stability by Zhao, Jiyun, Tso, Chih Ping, Tseng, King Jet

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Application of Electron Beam Melting (EBM) in Additive Manufacturing of an Impeller by Tan, Xipeng, Kok, Yihong, Tor, Shu Beng, Chua, Chee Kai

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Characterization techniques for power semiconductor and magnetic drives by Tseng, King Jet, Foo, Chek Fok, Tan, Cher Ming

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Low-carbon warehousing practices and challenges: Insights from emerging country by Azian, Ibrahim, Fernando, Yudi, Tseng, Ming-Lang, Lim, Ming K.

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Development of an ultra-stretchable double-network hydrogel for flexible strain sensors by Li, Huijun, Zheng, Han, Tan, Yu Jun, Tor, Shu Beng, Zhou, Kun

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Tribochemical Characterization and Tribocorrosive Behavior of CoCrMo Alloys: A Review by Toh, Wei Quan, Tan, Xipeng, Bhowmik, Ayan, Liu, Erjia, Tor, Shu Beng

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Rapid process modeling of the aerosol jet printing based on gaussian process regression with latin hypercube sampling by Zhang, Haining, Moon, Seung Ki, Ngo, T. H., Tou, J., Bin Mohamed Yusoff, M. A.

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Renewable energy integration into smart grids : problems and solutions — Singapore experience by Koh, Leong Hai, Tan, Yen Kheng, Wang, Peng, Tseng, King Jet

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Morphological multiparameter filtration and persistent homology in mitochondrial image analysis by Chung, Yu-Min, Hu, Chuan-Shen, Sun, Emily, Tseng, Henry C.

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Toward an Asian-based bodily movement database for emotional communication by Cheng, M, Tseng, C, Fujiwara, K, Higashiyama, S, Weng, A, Kitamura, Y

Multi-scale Modeling Of Additive Manufacturing Process by Seet, Gim Lee, Tor, Shu Beng, Chua, Chee Kai, Chandra, Shubham, Phanikumar, Gandham

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Titanium–aluminum–polytetrafluoroethylene coated stainless steel micromold via co-sputtering deposition : replication performance and limitation in hot-embossing by Hardt, David E., Chun, Jung H., Saha, Biswajit, Tor, Shu Beng, Liu, Erjia

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