Showing 1 - 2 results of 2 for search '(((ada OR pada) OR bond) OR bandar) ((rrffaces OR rrfffaces) OR (ace OR pace ))*', query time: 0.18s Refine Results
  1. 1
  2. 2

    Development of indexing clamper mechanism for wire bonder by Zhang, Yue.

    Published 2008
    “…For wire bonding integrated circuits, the state-of-art is 30 u.m fine pitch, and the position accuracy of material transmission for wire bonder is required to be 3.5 urn or less. …”
    Get full text
    Thesis