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aina » ainaa (Expand Search), bina (Expand Search), anna (Expand Search)
sainal » sainaal (Expand Search), sbinal (Expand Search), sannal (Expand Search), zainal (Expand Search), spinal (Expand Search), ainal (Expand Search)
spine » spin (Expand Search), spie (Expand Search), spike (Expand Search), sspine (Expand Search)
ping » ling (Expand Search), ming (Expand Search), peng (Expand Search), sping (Expand Search)
min » main (Expand Search)
swing » owing (Expand Search), wing (Expand Search), shing (Expand Search)
fine » find (Expand Search), five (Expand Search)
sspinn » ssspinn (Expand Search)
pin » spin (Expand Search)
line » like (Expand Search), life (Expand Search)
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2841
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2842
Analysis of tourism demand serial dependence structure for forecasting
Published 2017Get full text
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Journal Article -
2843
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2844
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2845
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2846
Thermodynamics of complexity and pattern manipulation
Published 2018Get full text
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Journal Article -
2847
Achieving secure and privacy-preserving incentive in vehicular cloud advertisement dissemination
Published 2018Get full text
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Journal Article -
2848
The recent development and applications of fluidic channels by 3D printing
Published 2018Get full text
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Journal Article -
2849
The Performance and Fouling Control of Submerged Hollow Fiber (HF) Systems: A Review
Published 2018Get full text
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Journal Article -
2850
Surface enhanced Raman spectroscopy for malaria diagnosis and intradermal measurements
Published 2018Get full text
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Journal Article -
2851
Optically reversible electrical soft-breakdown in wide-bandgap oxides — a factorial study
Published 2019Get full text
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Journal Article -
2852
Mechanisms of ciliary targeting: entering importins and Rabs
Published 2018Get full text
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Journal Article -
2853
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2854
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2855
PEIGEN – a platform for evaluation, implementation, and generation of S-boxes
Published 2019Get full text
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Journal Article -
2856
Ultrasensitive measurement of gas refractive index using an optical nanofiber coupler
Published 2019Get full text
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Journal Article -
2857
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2858
Temperature and stress distribution in the SOI structure during fabrication
Published 2009“…Although it is expected that the furnace temperature and withdrawal velocity are the key factors in determining the mechanical stresses, for the present bonding strength of wafers via wafer bonding technology, the withdrawal velocity must be less than 100 mm/min, and under such a withdrawal velocity, the furnace temperature is also an insignificant factor with regard to the induced stress.…”
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Journal Article -
2859
System crash as dynamics of complex networks
Published 2017Get full text
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Journal Article -
2860
White light single-shot interferometry with colour CCD camera for optical inspection of microsystems
Published 2015Get full text
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Conference Paper