Showing 701 - 720 results of 3,566 for search '(((bina OR (pinna OR yingna)) OR pine) OR (bin OR ((ying OR ming) OR (ling OR line))))', query time: 0.20s Refine Results
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    3D simulation-based research on the effect of interconnect structures on circuit reliability by He, Feifei, Tan, Cher Ming

    Published 2015
    “…The simulation of the EM reliability of the interconnects is usually performed using the line-via structure at the EM test temperature (e.g. 300 oC).However, such simulation using the line-via structure may not give the same void nucleation location as in the real circuit structure, especially at the circuit operation temperature (e.g. 90C). …”
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    Journal Article
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    A planar antenna in LTCC for single-package ultrawide-band radio by Chen, Ying, Zhang, Yue Ping

    Published 2009
    “…The antenna has an elliptical radiator fed through a microstrip line. The radiator and the microstrip line share the same ground plane with the other UWB radio circuitry. …”
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    Journal Article
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    State of mind by Ng, Jacelyn Jie Ling

    Published 2020
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    Final Year Project (FYP)
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