Effect of deep cold rolling on residual stress distributions between the treated and untreated regions Ti–6Al–4V alloy by Lim, Andre, Castagne, Sylvie, Chow, Cher Wong

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Temperature and stress distribution in the SOI structure during fabrication by Tan, Cher Ming, Gan, Zhenghao, Gao, Xiaofang

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Comparison of diagnostic performance and inter-reader agreement between PI-RADS v2.1 and PI-RADS v2: systematic review and meta-analysis by Lee, Chau Hung, Vellayappan, Balamurugan, Tan, Cher Heng

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The happiness revolution : live life now. by Hong, Shuqi., Cher, Fiona., Lin, Huanyu., Rusydi, Izzat.

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4.440 Basic Structural Theory, Spring 2003 by Ochsendorf, John Allen

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Understanding the dynamic behaviour and evolution of electric domains in BTO under applied electric field using in situ TEM by Li, Patrick Wen Feng

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Characterization techniques for power semiconductor and magnetic drives by Tseng, King Jet, Foo, Chek Fok, Tan, Cher Ming

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A study of management control systems in multinational corporations : a Singapore perspective by Ang, Cher Boon, Gan, Siok Hoon, Yip, Pei Wai

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Marketing on internet :case studies on Singapore companies. by Cher, Ming Hui., Chow, Hui Woon., Teo, Cheng Hoon.

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The four mini dragons by Ding, See Yue, Leo, Cher Ling, Seah, Boon Hock

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The impact of information technology on banking services in Singapore by Ang, Cher Hao, Quah, Kwee Seng, Teo, Shann Wei

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The influence of flexible working arrangements on employee turnover intention by Bhasin Yuvraj Vijay, Yang, Cher Ming, Chan, Ngok Chuin

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Textile industry in Singapore : the relationship between fringe benefits and industry performance by How Wen-Li Lorraine, Lim Sheau Huei, Tan Cher Ting

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Additive manufacturing of multiple materials by selective laser melting : Ti-alloy to stainless steel via a Cu-alloy interlayer by Tey, Cher Fu, Tan, Xipeng, Sing, Swee Leong, Yeong, Wai Yee

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21A.100 Introduction to Anthropology, Fall 2004 by Howe, James

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Ab initio simulation of electronic and mechanical properties of aluminium for fatigue early feature investigation by Zhang, Shuai, Tan, Cher Ming, Cheng, Shuguang, Deng, Tianqi, He, Feifei, Su, Haibin

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Creep mitigation in Sn–Ag–Cu composite solder with Ni-coated carbon nanotubes by Nai, S. M. L., Xu, L. Y., Wei, J., Han, Yongdian, Jing, Hongyang, Tan, Cher Ming

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4.462 / 4.441 Building Technologies II: Building Structural Systems I, Spring 2003 by Ochsendorf, John Allen

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Investigation of the reliability of nano-nickel/niobium oxide-based multilayer thin films deposited on polymer substrates for flexible electronic applications by Sahay, Rahul, Tu, Yen-Cheng, Aziz, Izzat, Budiman, Arief S., Tan, Cher Ming, Lee, Pooi See, Thomas, Olivier, Raghavan, Nagarajan

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Erasure temperature measurements of heat assisted magnetic recording media by Chen, Y. J., Yang, H. Z., Leong, S. H., Cher, K. M., Hu, J. F., Sethi, P., Lew, Wen Siang

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