Critical temperatures in thermocompression gold stud bonding by Zhang, G. G., Ang, X. F., Chen, Z., Wong, Chee C., Wei, J.

“…A study on temperature dependence in gold-gold (Au–Au) thermocompression bonding was performed. Gold studs were bonded to two kinds of surfaces—cofired gold on alumina and electroless nickel covered with immersion Au on silicon. …”
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Low temperature Cu-Cu thermo-compression bonding with temporary passivation of self-assembled monolayer and its bond strength enhancement by Ang, X. F., Wei, J., Leong, K. C., Tan, Chuan Seng, Lim, Dau Fatt

“…This gives rise to enhancement in shear strength in the bonded Cusingle bondCu layer.…”
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Selective catalytic sp3 C–O bond cleavage with C–N bond formation in 3-alkoxy-1-propanols by Chen, Cheng, Hong, Soon Hyeok

“…Based on the experimental results, O-bound and C-bound Ru enolate complexes were proposed as key intermediates for the unique selective sp3 C–O bond cleavage in 3-alkoxy-1-propanols.…”
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C-F bond activation by transient phosphenium dications by Đorđević, Nemanja, Tay, Madelyn Qin Yi, Muthaiah, Senthilkumar, Ganguly, Rakesh, Dimić, Dušan, Vidović, Dragoslav

“…C–F bond cleavage by transient phosphorus(III)-based dications [RP(C(PPh3)2)]2+ (4a2+, R = Ph; 4b2+, R = 4-F-Ph) is reported. …”
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Examination of high strength steel design provisions : bond by Chua, Aye Neng

“…This project aims to provide a comprehensive comparison among seven deterministic bond stress-slip models developed in the past research, and to enhance their applicability by establishing the bond-slip statistical cloud model. …”
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Peptide asparaginyl ligases—renegade peptide bond makers by Tam, James P., Chan, Ning-Yu, Liew, Heng Tai, Tan, Shaun J., Chen, Yu

“…Making peptide bonds is tightly controlled by genetic code and machinery which includes cofactors, ATP, and RNAs. …”
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Factors influencing bond issuance of the Singapore corporate sector by Pu Ling, Yong Xin Mei

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Effect of hydrogen bond interaction on protein phase transition by Leong, Hon Wai, Chew, Lock Yue

“…We derive the grand partition function of protein chain by restricting dihedral angles to exist only in five distinct states and assume that the dominant noncovalent potential is the hydrogen bond interaction. We investigate the phase transition of protein secondary structures and the order of the transition through analyzing its heat capacity. …”
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Social bonds and community support are vital to prison reform by Newson, M, Whitehouse, H

“…This research highlights the importance of fostering positive group bonds and community support to enhance reintegration efforts and reduce reoffending rates.…”

Ultrasonic non-destructive testing of adhesive bonded aluminum plates / by Azim Fikri Mhd. Subre, 1988-, author 613023, Md. Super Rohani, supervisor 620637, Fakulti Sains 8004

Ultrasonic non-destructive testing of adhesive bonded aluminum plates / by Azim Fikri Mhd. Subre, 1988-, author 613023

The municipal bond valuation puzzle : evidence from U.S. States by Scott, Justin Rand.

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Recent development in halogen-bonding-catalyzed living radical polymerization by Wang, Chen-Gang, Chong, Amerlyn Ming Liing, Pan, Matthew Houwen, Sarkar, Jit, Tay, Xiu Ting, Goto, Atsushi

“…Halogen bonding (XB) has been used to catalyze organic reactions and polymerizations, which is an emerging research area. …”
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Interfacial bonding and abrasive wear behaviours of the iron matrix composites by Li, Cong, Shi, Jing, Li, Yuehui, Li, Yefei, Gao, Yimin, Li, Bo, Goei, Ronn, Cheng, Chunyu, Zhao, Siyong, Tok, Alfred Iing Yoong

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Debonding of bonded composite joints with TEP modified epoxy adhesives by Caglar, Hasan, Sridhar, Idapalapati, Sharma, Mohit, Chian, Kerm Sin

“…Plasma surface treatment provided higher bond strength at room temperature than sandblasting surface treatment and prevented fiber-tearing. …”
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Evaluation of process requirements for room temperature direct copper bonding by Chen, Qiang.

“…Direct metal bonding is a method of joining two metal surfaces under ambient conditions without an intermediate layer in between. …”
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Investigation of low temperature wafer bonding using intermediate layer by Deng, Shusheng

“…In this project, the sol-gel intermediate layer bonding is demonstrated to provide high bond strength at low temperature (such as 100 degree celsius).…”
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Permanent polymer bonding for MEMS device fabrication and packaging applications by Lim, Eugene KaiSheng.

“…Wafers were bonded with both patterned BCB and blanket BCB. …”
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1,3,2-diazaphospholene-catalysed reduction of unsaturated bonds by Chong, Che Chang

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Oxidation of a P-C Bond under Mild Conditions by Ilić, Gordana, Gaguly, Rakesh, Petković, Milena, Vidović, Dragoslav

“…This compound was then identified as an analogue of the elusive Criegee intermediate as it underwent oxygen insertion into the P[BOND]C bond through a mechanism usually observed for Baeyer–Villiger oxidations. …”
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