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    Failure analysis and characterization for microelectronic packaging by Lin, Pamela

    Published 2017
    “…In the recent years, the mechanical robustness and reliability of three-dimensional (3D) integrated circuit (IC) packaging have become tremendously challenging due to its continuous reduction in size and increase in vertical integration. …”
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    Thesis
  3. 19243

    Pnictogen-halide semiconductors for photovoltaics by Liu, P

    Published 2025
    “…<p>Indoor photovoltaic (IPV) development has garnered increasing interest in recent years because of the potential to sustainably provide energy to the billions of autonomous devices part of the Internet of Things (IoT) ecosystem. …”
    Thesis
  4. 19244

    A machine-learned approach for reducing airborne delays and environmental impact in terminal manoeuvring area using extended arrival management by Lim, Zhi Jun

    Published 2024
    “…Although COVID-19 temporarily reduced delays due to decreased traffic, many large hubs have now returned to pre-pandemic levels, with strong growth expected in the coming years. Air traffic management divides the airspace into three sections: the airport control zone (taxiing, takeoff, landing), the terminal manoeuvring area (TMA, for climbs and descents), and the en-route airspace (cruise). …”
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    Thesis-Doctor of Philosophy
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