Showing 761 - 780 results of 1,659 for search '(((pina OR ((sspine OR spinae) OR pingene)) OR fine) OR (ling OR pin))', query time: 0.16s Refine Results
  1. 761
  2. 762

    Analog smart I/O pads by Tan, Shyue Mei.

    Published 2009
    “…ESD is an increasingly significant problem in integrated circuit design as increasing pin counts and faster circuit speeds compound the need for more and better reliable ESD protection. …”
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    Final Year Project (FYP)
  3. 763

    Tribological properties of wax microcapsule modified polymers by Ang, Ping Lon

    Published 2013
    “…The tribology test uses the Pin-On-Disk wear test method and the default tribometer settings used in this project were set at 2000m sliding distance, 40cm/s linear speed and 3N linear load. …”
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    Final Year Project (FYP)
  4. 764

    Effect of emulsion temperature on physical properties of palm oil‐based margarine by Miskandar, M. S., Che Man, Y. B., Yusoff, M. S. A., Abdul Rahman, R.

    Published 2002
    “…The emulsion temperatures studied were 40, 45, and 50°C, with other parameters such as emulsion flow rates, tube cooler temperature, and pin rotor speed kept constant. The SFC developed during processing and storage at 28°C was measured to evaluate the quality of margarine. …”
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    Article
  5. 765
  6. 766
  7. 767
  8. 768

    A physical model for sloping capillary barriers by Rahardjo, Harianto, Tami, Denny, Leong, Eng Choon, Fredlund, Delwyn G.

    Published 2011
    “…A sloping two-layer capillary barrier model consisting of a relatively fine soil layer over a relatively coarse soil layer was constructed inside a specially designed apparatus. …”
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    Journal Article
  9. 769

    Anomaly detection in aerosol jet printing via computer vision & machine learning by Ang, Ryan Wei Hao

    Published 2023
    “…The Aerosol Jet Printing (AJP) technique is a relatively new contactless direct write method that is being developed for the purpose of producing fine features on a diverse selection of surfaces. …”
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    Final Year Project (FYP)
  10. 770

    Flip chip joint-in-via architecture on flexible substrates with Au-Sn interdiffusion bonding by Lee, Teck Kheng

    Published 2008
    “…Field applications using existing packaging infrastructure has demonstrated the robustness of applying the SLICF bonding with the joint-in-via architecture for fine pitch flip-chip applications.…”
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    Thesis
  11. 771

    Lattice code design for the Rayleigh fading wiretap channel by Belfiore, Jean-Claude, Oggier, Frederique

    Published 2011
    “…We present a design criterion for both the fine and coarse lattice to obtain wire tap lattice codes for the Rayleigh fading Wiretap Channel.…”
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    Conference Paper
  12. 772
  13. 773
  14. 774

    Acid FYP report by Woo, Bao Xin

    Published 2018
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    Final Year Project (FYP)
  15. 775

    Fabrication of heat sinks by Selective Laser Melting for convective heat transfer applications by Wong, Kin Keong, Ho, Jin Yao, Leong, Kai Choong, Wong, Teck Neng

    Published 2021
    “…Three heat sinks comprising pin fins of circular, rectangular-rounded and aerofoil geometries were fabricated by SLM from aluminium alloy AlSi10Mg powder. …”
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    Journal Article
  16. 776

    A Novel MIMO antenna integrated with a solar panel and employing AI-equalization for 5G wireless communication networks by Hussein, Humam, Elmunim, Nouf Abd, Atasoy, Ferhat, Virdee, Bal Singh, Elwi, Taha A., Rashid, Nasr, Jayanthi, Renu Karthick Rajaguru, Alibakhshikenari, Mohammad, Limiti, Ernesto

    Published 2024
    “…We demonstrate that the directivity of this antenna array can be precisely electronically reconfigured using PIN diode switches. Additionally, we show the feasibility of integrating solar panels with the proposed MIMO antenna array. …”
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    Article
  17. 777
  18. 778

    贈り物 : gift by Pang, Desmond Hee Wee

    Published 2011
    “…The skills and knowledge that I have learnt from my major have led me to be more experimental and fine art in my approach towards my works. Therefore I feel that a hands-on, ‘back to basics approach’ is the best way to express this project. …”
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    Final Year Project (FYP)
  19. 779
  20. 780