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Package and board level reliability modeling of advanced CSP pakages for telecommunication applications
Published 2008“…These technology requirements are possible with the recent development of advanced Chip Scale Packages (CSPs), such as thin-profile fine-pitch Ball Grid Array (TFBGA), Quad-Flat-No-lead (QFN), and wafer-level CSP (WL-CSP). …”
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Thesis -
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Enhancing sentiment analysis on social media data
Published 2016“…This report explains my extensive research on the engine’s improvement from the following three perspectives: Fine-grained analysis of the sentiment including specific emotions, associate the sentiment with the topics and compute a domain-specific word’s polarity. …”
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Final Year Project (FYP) -
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Typeical Singapore : tracing Singapore's history through vernacular typography
Published 2018Get full text
Final Year Project (FYP) -
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AutoAD III: the prequel – back to the pixels
Published 2024“…Generating Audio Description (AD) for movies is a challenging task that requires fine-grained visual understanding and an awareness of the characters and their names. …”
Conference item -
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Modeling of electric MHD flow of nanoparticles in a CMC-water based casson hybrid nanofluid over a porous medium
Published 2024“…The impact of these parameters on velocity and temperature profiles, as well as on the skin friction coefficient and Nusselt number of the nanofluid, is observed. …”
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Article -
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Dual layer composite nanofiltration hollow fiber membranes for low-pressure water softening
Published 2014“…Therefore, the development of novel NF membranes with a positively charged skin has become a key issue for low pressure water softening. …”
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Journal Article