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  5. 145

    PCA based feature extraction for cell image retrieval by Ananthagunan Muthukumaran

    Published 2009
    “…Recognition is performed by projecting a new image into the subspace spanned by the Eigen images and then classifying the image by comparing its position in Eigen space with the positions of known individuals. …”
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    Thesis
  6. 146

    Design and investigation of air-cooled heat sinks using 3D printing technology by Lim, Ming Chong

    Published 2016
    “…This study presents the heat transfer performance of five pin fin heat sinks that have been fabricated using Selective Laser Melting. …”
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    Final Year Project (FYP)
  7. 147

    Real time analysis of social behavior from video and kinect recordings by Ramasamy, Pandi Ramesh

    Published 2016
    “…Finally,analysis will be performed using pattern recognition algorithms and machine learning classifiers to detect the emotion of the subject.In this project,machine learning classifiers such as K-nearest neighbors,Naive Bayes and C4.5 Decision tree learning has been used. The prime aim is to pin point the most seemly machine learning classifier for obtaining highest accuracy for classification.…”
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    Thesis
  8. 148

    Real world mathematics : the design of mathematics trails by Soh, Karen Jasmine.

    Published 2008
    “…The development of the trail spanned a period of 6 months. The students were guided in the development of the trail where necessary. …”
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    Thesis
  9. 149
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  12. 152

    Convective boiling and condensation in enhanced tubes produced by selective laser melting by Tan, Choon Yong

    Published 2018
    “…The design of the four tubes are five long circumferential pin fins, eight short circumferential pin fins, twisted pin fins and a metallic foam structure. …”
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    Final Year Project (FYP)
  13. 153

    A two-dimensional co-rotational Timoshenko beam element with XFEM formulation by Xu, Jin, Lee, Chi King, Tan, Kang Hai

    Published 2014
    “…Pin connections and plastic hinges produce non-smooth displacement fields in beam structures. …”
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    Journal Article
  14. 154

    Study of heat transfer through micro-structured surfaces by Chin, Wei Hao

    Published 2016
    “…Each chip has a different microstructure in the form of very small and elongated pin-fins, which will in turn affect the critical heat flux of each component. …”
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    Final Year Project (FYP)
  15. 155

    Design of wideband low-loss reconfigurable reflectarray antenna by Zhang, Xiran

    Published 2024
    “…It proposes an RRA design that integrates a PIN diode with air gap. The switch of the reconfigurable unit is directly mounted on the reflective element, reducing the loss introduced by the switching device. …”
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    Thesis-Master by Coursework
  16. 156

    Development of optical transceiver by Sim, Sebastian Shih Wei.

    Published 2010
    “…For PIN photodiodes, the epitaxial layer was introduced to the structures to act as an intrinsic layer. …”
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    Final Year Project (FYP)
  17. 157
  18. 158

    Emotikon : audio production of the interpretation of human emotion through soundscape and music by De Cotta, Timothy Alexander, Long, Lyndsey Liting

    Published 2011
    “…We wanted to appeal to the various feelings of the listener in five songs that spanned a range of musical genres, and more ambitiously, try to manipulate how the listener was feeling in a short period of time.…”
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    Final Year Project (FYP)
  19. 159

    Automatic test chip set by Chin, Edward Hsi Ling.

    Published 2008
    “…In this project, the fundamental functions and basic circuitry of an universal pin electronics are investigated and designed.…”
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    Research Report
  20. 160

    Reverse logistic operations in Asia-Pacific : an emprical study by Ho, Alex Chew Kin.

    Published 2008
    “…A 12-page survey is launched covering three main sections — Part 1: Company Profile; Part 2: Reverse Logistics Process; and Part 3: Reverse Logistics Information System. 145 companies were surveyed with a 15.7% response rate. Companies selected spanned across different industrial sectors: electronic/semi-conductor, consumer electronics, telecommunications, computer, data storage/disk drive, machinery/heavy metal, chemical and medical equipment supplies. …”
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    Thesis