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    3D simulation-based research on the effect of interconnect structures on circuit reliability by He, Feifei, Tan, Cher Ming

    Published 2015
    “…The simulation of the EM reliability of the interconnects is usually performed using the line-via structure at the EM test temperature (e.g. 300 oC).However, such simulation using the line-via structure may not give the same void nucleation location as in the real circuit structure, especially at the circuit operation temperature (e.g. 90C). …”
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    Beyond national identity : Kuo Pao Kun’s contemporary theatre and an open culture by Wee, C. J. Wan-Ling

    Published 2022
    “…The present, “globalised” moment requires freedom from local jurisdictions: this is the line of thought regarding a truly contemporary theatre’s direction cut short by his demise in 2002. …”
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    Journal Article
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