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pinna » pina (Expand Search), pinn (Expand Search)
shinae » shine (Expand Search), shina (Expand Search), shinde (Expand Search), thinae (Expand Search), chinae (Expand Search), shiae (Expand Search)
spie » spin (Expand Search)
mings » mingos (Expand Search), rings (Expand Search), minds (Expand Search), lings (Expand Search), maings (Expand Search)
shin » thin (Expand Search), chin (Expand Search), shi (Expand Search)
ming » ling (Expand Search), maing (Expand Search)
min » main (Expand Search)
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Global minimum variance portfolio : an application to the Singapore stock market
Published 2013Get full text
Final Year Project (FYP) -
344
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345
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Automatic work piece locating, clamping and setup system for machining centers
Published 2011Get full text
Research Report -
348
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A Japan with Fewer Japanese: Enter the Machines
Published 2017Get full text
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Commentary -
352
Measurement and calibration of a six-axis reconfigurable parallel robot system
Published 2008Get full text
Research Report -
353
The Sixth Trilateral Summit: Style Over Substance?
Published 2015Get full text
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Commentary -
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Practical support structures for selective laser melting
Published 2018Get full text
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Journal Article -
358
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359
Temperature and stress distribution in the SOI structure during fabrication
Published 2009“…Although it is expected that the furnace temperature and withdrawal velocity are the key factors in determining the mechanical stresses, for the present bonding strength of wafers via wafer bonding technology, the withdrawal velocity must be less than 100 mm/min, and under such a withdrawal velocity, the furnace temperature is also an insignificant factor with regard to the induced stress.…”
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Journal Article -
360
Unusual Na+ ion intercalation/deintercalation in metal-rich Cu1.8S for Na-ion batteries
Published 2020Get full text
Journal Article