Kinematic analysis and optimal design of three-legged reconfigurable parallel manipulators by Anjan Kumar Dash

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Analog smart I/O pads by Tan, Shyue Mei.

“…ESD is an increasingly significant problem in integrated circuit design as increasing pin counts and faster circuit speeds compound the need for more and better reliable ESD protection. …”
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Tribological properties of wax microcapsule modified polymers by Ang, Ping Lon

“…The tribology test uses the Pin-On-Disk wear test method and the default tribometer settings used in this project were set at 2000m sliding distance, 40cm/s linear speed and 3N linear load. …”
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Effect of emulsion temperature on physical properties of palm oil‐based margarine by Miskandar, M. S., Che Man, Y. B., Yusoff, M. S. A., Abdul Rahman, R.

“…The emulsion temperatures studied were 40, 45, and 50°C, with other parameters such as emulsion flow rates, tube cooler temperature, and pin rotor speed kept constant. The SFC developed during processing and storage at 28°C was measured to evaluate the quality of margarine. …”
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Banks regulatory reforms in Singapore. by Foo, Cindy Ping Ping., Lee, Shirleen Sok Loon., Ng, Mui Chee.

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Studies of wafer level electromigration test for ULSI by Sum, Heng Keong.

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Design of insulated gate bipolar transistor using novel structure by Zhang, Guowei

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Recognition of human hand gestures and its application to human-robot interaction by Yin, Xiaoming.

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A physical model for sloping capillary barriers by Rahardjo, Harianto, Tami, Denny, Leong, Eng Choon, Fredlund, Delwyn G.

“…A sloping two-layer capillary barrier model consisting of a relatively fine soil layer over a relatively coarse soil layer was constructed inside a specially designed apparatus. …”
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Anomaly detection in aerosol jet printing via computer vision & machine learning by Ang, Ryan Wei Hao

“…The Aerosol Jet Printing (AJP) technique is a relatively new contactless direct write method that is being developed for the purpose of producing fine features on a diverse selection of surfaces. …”
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Flip chip joint-in-via architecture on flexible substrates with Au-Sn interdiffusion bonding by Lee, Teck Kheng

“…Field applications using existing packaging infrastructure has demonstrated the robustness of applying the SLICF bonding with the joint-in-via architecture for fine pitch flip-chip applications.…”
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Lattice code design for the Rayleigh fading wiretap channel by Belfiore, Jean-Claude, Oggier, Frederique

“…We present a design criterion for both the fine and coarse lattice to obtain wire tap lattice codes for the Rayleigh fading Wiretap Channel.…”
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Acid FYP report by Woo, Bao Xin

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A Novel MIMO antenna integrated with a solar panel and employing AI-equalization for 5G wireless communication networks by Hussein, Humam, Elmunim, Nouf Abd, Atasoy, Ferhat, Virdee, Bal Singh, Elwi, Taha A., Rashid, Nasr, Jayanthi, Renu Karthick Rajaguru, Alibakhshikenari, Mohammad, Limiti, Ernesto

“…We demonstrate that the directivity of this antenna array can be precisely electronically reconfigured using PIN diode switches. Additionally, we show the feasibility of integrating solar panels with the proposed MIMO antenna array. …”
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ProtAgents: Protein discovery via large language model multi-agent collaborations combining physics and machine learning by Ghafarollahi, Alireza, Buehler, Markus J.

“…Current methodologies for protein design often rely on AI-based models, such as surrogate models that address end-to-end problems by linking protein structure to material properties or vice versa. However, these models frequently focus on specific material objectives or structural properties, limiting their flexibility when incorporating out-of-domain knowledge into the design process or comprehensive data analysis is required. …”
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Degradation Mechanisms and Applications in Ion Intercalation Materials by Zhuang, Debbie

“…Overall, I set up a consistent framework modeling degradation from single particle to population level and vice versa in LiBs.…”
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Optimization of Sb2(S, Se)3 photoabsorbers for photoelectrochemical hydrogen evolution reaction by Lee, Kian Jie

“…However, there was a preferred growth orientation of (hk1) over (hk0) plane for the samples with 10% Se when annealing temperature increased, and vice versa for the samples with 20% Se. Moreover, all antimony chalcogenide films show compact morphology without any presence of the pinholes. …”
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Evaluation of CQAs by Banerjee Snehasish

“…However, the English sites outdo the Chinese sites in terms of answer responsiveness; and vice-versa in terms of corpus comprehensiveness. …”
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Semiparametric regression analysis of clustered survival data with semi-competing risks by Peng, Mengjiao, Xiang, Liming, Wang, Shanshan

“…Analysis of semi-competing risks data is becoming increasingly important in medical research in which a subject may experience both nonterminal and terminal events, and the time to the intermediate nonterminal event (e.g. onset of a disease) is subject to dependent censoring by the terminal event (e.g. death) but not vice versa. Typically, both two types of events are dependent. …”
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On semidefinite programming relaxations of the traveling salesman problem by De Klerk, Etienne., Pasechnik, Dmitrii V., Sotirov, Renata.

“…Unlike the bound of Cvetković et al., the new SDP bound is not dominated by the Held–Karp linear programming bound, or vice versa.…”
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