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    Tantalum based amorphous thin films as copper diffusion barrier by Yan, Hua

    Published 2013
    “…With the fast development of semiconductor industry, a novel barrier is required in order to address two challenges in the back-end-of-line technology: enhancing the interconnect reliability of back-end-of-line and reducing resistance-capacitance delay faced during further scaling of semiconductor devices. …”
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    Performance and functional enhancement of artificial market psychology simulator by Akula, Mohan Kumar, 1978-

    Published 2006
    “…Thesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Civil and Environmental Engineering, 2004.…”
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