Showing 341 - 360 results of 2,914 for search '(((pinnau OR (ince OR spinge)) OR line) OR (pink OR (pin OR ming)))', query time: 0.18s Refine Results
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    Data analytics on maps by Boey, Jackson Ming Hui

    Published 2018
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    Final Year Project (FYP)
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    3D simulation-based research on the effect of interconnect structures on circuit reliability by He, Feifei, Tan, Cher Ming

    Published 2015
    “…The simulation of the EM reliability of the interconnects is usually performed using the line-via structure at the EM test temperature (e.g. 300 oC).However, such simulation using the line-via structure may not give the same void nucleation location as in the real circuit structure, especially at the circuit operation temperature (e.g. 90C). …”
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    Journal Article
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