Showing 841 - 860 results of 2,394 for search '(((pinnau OR pinna) OR ((pine OR (fine OR line)) OR sspine)) OR (pinn OR pin))', query time: 0.18s Refine Results
  1. 841
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  3. 843

    Development of indexing clamper mechanism for wire bonder by Zhang, Yue.

    Published 2008
    “…For wire bonding integrated circuits, the state-of-art is 30 u.m fine pitch, and the position accuracy of material transmission for wire bonder is required to be 3.5 urn or less. …”
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    Thesis
  4. 844
  5. 845
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  7. 847

    Package and board level reliability modeling of advanced CSP pakages for telecommunication applications by Tee, Tong Yan

    Published 2008
    “…These technology requirements are possible with the recent development of advanced Chip Scale Packages (CSPs), such as thin-profile fine-pitch Ball Grid Array (TFBGA), Quad-Flat-No-lead (QFN), and wafer-level CSP (WL-CSP). …”
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    Thesis
  8. 848

    Enhancing sentiment analysis on social media data by Ruan, Pingcheng

    Published 2016
    “…This report explains my extensive research on the engine’s improvement from the following three perspectives: Fine-grained analysis of the sentiment including specific emotions, associate the sentiment with the topics and compute a domain-specific word’s polarity. …”
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    Final Year Project (FYP)
  9. 849

    Finitude by Lim, Hong Wei

    Published 2016
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    Final Year Project (FYP)
  10. 850
  11. 851

    Belly green by Teo, Gillian Pei Yi

    Published 2017
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    Final Year Project (FYP)
  12. 852

    Analog future by Chan, Allan Joon Chiew

    Published 2017
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    Final Year Project (FYP)
  13. 853
  14. 854

    My garden of you by Chen, Zhi Lin

    Published 2017
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    Final Year Project (FYP)
  15. 855
  16. 856

    Lacuna by Tng, Gabriel Yue Hao

    Published 2017
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    Final Year Project (FYP)
  17. 857

    The musician chair by Yin, Jiayi

    Published 2018
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    Final Year Project (FYP)
  18. 858

    Liddat oso can by Tng, Adeline Wen Ting

    Published 2018
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    Final Year Project (FYP)
  19. 859
  20. 860

    Cloud nine by Li, Joan Zheying

    Published 2019
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    Final Year Project (FYP)