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pinnau » pinna (Expand Search), pinnae (Expand Search)
shin » thin (Expand Search), chin (Expand Search), shi (Expand Search)
spie » spin (Expand Search)
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sling » esling (Expand Search), shing (Expand Search), swing (Expand Search), slong (Expand Search), sline (Expand Search), slink (Expand Search)
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A Japan with Fewer Japanese: Enter the Machines
Published 2017Get full text
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Commentary -
504
Measurement and calibration of a six-axis reconfigurable parallel robot system
Published 2008Get full text
Research Report -
505
The Sixth Trilateral Summit: Style Over Substance?
Published 2015Get full text
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Commentary -
506
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507
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509
Practical support structures for selective laser melting
Published 2018Get full text
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Journal Article -
510
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511
Historicity and the contemporary theatre of Kuo Pao Kun and Krishen Jit
Published 2020Get full text
Journal Article -
512
Beyond national identity : Kuo Pao Kun’s contemporary theatre and an open culture
Published 2022Get full text
Journal Article -
513
Proteomics of hair: effects of pH on the hair shaft
Published 2023Get full text
Final Year Project (FYP) -
514
Deadweight costs and optimal capital structure.
Published 2011Get full text
Final Year Project (FYP) -
515
Factors influencing bond issuance of the Singapore corporate sector
Published 2014Get full text
Final Year Project (FYP) -
516
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518
Temperature and stress distribution in the SOI structure during fabrication
Published 2009“…Although it is expected that the furnace temperature and withdrawal velocity are the key factors in determining the mechanical stresses, for the present bonding strength of wafers via wafer bonding technology, the withdrawal velocity must be less than 100 mm/min, and under such a withdrawal velocity, the furnace temperature is also an insignificant factor with regard to the induced stress.…”
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Journal Article -
519
Unusual Na+ ion intercalation/deintercalation in metal-rich Cu1.8S for Na-ion batteries
Published 2020Get full text
Journal Article -
520