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Temperature and stress distribution in the SOI structure during fabrication
Published 2009“…Although it is expected that the furnace temperature and withdrawal velocity are the key factors in determining the mechanical stresses, for the present bonding strength of wafers via wafer bonding technology, the withdrawal velocity must be less than 100 mm/min, and under such a withdrawal velocity, the furnace temperature is also an insignificant factor with regard to the induced stress.…”
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Journal Article -
345
Watches in focus : from a global to local perspective.
Published 2008Get full text
Final Year Project (FYP) -
346
A study of summary annual reports issued in Singapore.
Published 2008Get full text
Final Year Project (FYP) -
347
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348
The effectiveness of different types of monetary incentives to download the TraceTogether application
Published 2021Get full text
Final Year Project (FYP) -
349
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350
Commentary is free: issue management and gaining capital with thought leadership
Published 2023Get full text
Journal Article -
351
How does relative income affect mental health within a developing country? The case of Indonesia
Published 2024Get full text
Final Year Project (FYP) -
352
Nonverbal communication cues of bank CEOs and long term performance during financial crisis.
Published 2013Get full text
Final Year Project (FYP) -
353
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355
Balance of payments in Singapore since independence.
Published 2008Get full text
Final Year Project (FYP) -
356
Ultra low-voltage low-power CMOS 4-2 and 5-2 compressors for fast arithmetic circuits
Published 2009Get full text
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Journal Article -
357
Intangibles : an empirical study on the valuation of biotechnology firms.
Published 2008Get full text
Final Year Project (FYP) -
358
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360