Showing 521 - 540 results of 4,295 for search '(((pinnau OR shine) OR spie) OR ((mings OR slong) OR (((ming OR maing) OR min) OR (ling OR line))))', query time: 0.22s Refine Results
  1. 521
  2. 522
  3. 523

    3D simulation-based research on the effect of interconnect structures on circuit reliability by He, Feifei, Tan, Cher Ming

    Published 2015
    “…The simulation of the EM reliability of the interconnects is usually performed using the line-via structure at the EM test temperature (e.g. 300 oC).However, such simulation using the line-via structure may not give the same void nucleation location as in the real circuit structure, especially at the circuit operation temperature (e.g. 90C). …”
    Get full text
    Get full text
    Get full text
    Journal Article
  4. 524
  5. 525
  6. 526
  7. 527
  8. 528
  9. 529
  10. 530
  11. 531
  12. 532
  13. 533
  14. 534
  15. 535

    State of mind by Ng, Jacelyn Jie Ling

    Published 2020
    Get full text
    Final Year Project (FYP)
  16. 536
  17. 537
  18. 538
  19. 539
  20. 540