Showing 261 - 280 results of 3,838 for search '(((sainan OR (shide OR (shin OR chin))) OR (spike OR like)) OR ((bing OR sspingg) OR pin))', query time: 0.19s Refine Results
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    Study of heat transfer through micro-structured surfaces by Chin, Wei Hao

    Published 2016
    “…Each chip has a different microstructure in the form of very small and elongated pin-fins, which will in turn affect the critical heat flux of each component. …”
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    Final Year Project (FYP)
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    Web-based interactive graph visualization by Ng, Chin Teck

    Published 2018
    “…By the end of the project, a prototype of the website will be developed with basic analysis functions implemented and continuation of this project is to be expected therefore, the website will be built with extensibility in mind. Improvements, like additional clustering methods, ways to differentiate data through colour coding and further optimizing the algorithm can be implemented in the near future.…”
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    Final Year Project (FYP)
  17. 277

    Design of optical building blocks for photonic integration by Chin, Mee Koy.

    Published 2008
    “…Defect states within the photonic bandgaps behave like either donor or acceptor modes similar to other photonic crystals. …”
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    Research Report
  18. 278

    Solar air conditioning using adsorption cooling II by Chua, Chin Chye.

    Published 2011
    “…The hardware design includes like the circuit design and layout of the system controller; and the programming part which comprises the writing of program and the use of compilers for microcontroller. …”
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    Final Year Project (FYP)
  19. 279

    Federated learning for edge computing by Low, Chin Poh

    Published 2024
    “…I will test these models’ using data from a variety of sources to ensure they operate well in real-world scenarios while maintaining people's privacy. Second, I would like to understand more about the unique characteristics of decentralized datasets. …”
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    Final Year Project (FYP)
  20. 280

    Anisotropic conductive adhesive for micro joining in semiconductor interconnects application (solder alternative for fine pitch & environment friendly IC packaging) by Goh, Chin Foo

    Published 2008
    “…The development of anisotropic and isotropic conductive adhesives (ACA & ICA respectively) as an alternative to solder bumps has received extensive attention in flip chip packaging as it offers an array of advantages like finer pitch interconnects, green processes, low cost, and low temperature processing. …”
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    Thesis