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    Adhesive curing through low-voltage activation by Ping, Jianfeng, Gao, Feng, Chen, Jian Lin, Webster, Richard David, Steele, Terry W. J.

    Published 2017
    “…The electrocuring adhesives are activated at −2 V versus Ag/AgCl, allowing tunable crosslinking within the dendrimer matrix and on both electrode surfaces. …”
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    Journal Article
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