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  1. 1721

    Supporting organizational professional culture with collaborative technology during design phase in industrialized project delivery in Malaysia by R., Ibrahim, Abdul Ghafar, M.

    Published 2022
    “…The purpose of this case study research is to distinguish the base line communication preferences that could aid policy makers and building professionals to prepare themselves to deliver the smart city implementation. …”
    Book Section
  2. 1722

    Role of Macroeconomic Factors, Institutional Quality and Digitalization Towards Performance of Islamic Microfinance Institutions by Ahmed, Mushtaq, Isa, Mohamad Yazid

    Published 2023
    “…The success of microfinance institutions is uneven in achieving both objectives, some achieve one objective, either financial or social, while some fail to achieve any objective altogether. In this line, study uses panel data of 35 Islamic microfinance institutions of OIC countries to investigate the impact of macroeconomic, macro institutional factors and digitalization on the financial and social performance of microfinance institutions in OIC countries from 2008 to 2019. …”
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    Article
  3. 1723

    Enhancing Performance of Private Higher Education Institution through Strategic Excellence Model (S/O 13617) by Abdullah, Haim Hilman

    Published 2020
    “…In the context of Malaysia, education has been earmarked as one of the important national agenda in line with the 11th Malaysia. Plan that is designed to make the country a knowledge-based economy. …”
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    Monograph
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    Developments in THz Polaritonics: Towards Integrated Nonlinear THz Spectroscopy by Sung, Eric Rueyhao

    Published 2024
    “…In a typical polaritonics experiment, the optical pump light is focused to a single line which launches THz fields with electric field strengths of approximately 10 kV/cm. …”
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    Thesis
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    Tantalum based amorphous thin films as copper diffusion barrier by Yan, Hua

    Published 2013
    “…With the fast development of semiconductor industry, a novel barrier is required in order to address two challenges in the back-end-of-line technology: enhancing the interconnect reliability of back-end-of-line and reducing resistance-capacitance delay faced during further scaling of semiconductor devices. …”
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    Thesis
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