Showing 881 - 900 results of 1,368 for search '(((spinae OR (shinae OR shinde)) OR (spine OR fine)) OR ((pina OR sping) OR ping))', query time: 0.18s Refine Results
  1. 881

    Under the Roof by Cheah, Sue Lyn

    Published 2023
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    Final Year Project (FYP)
  2. 882

    Covert by Chia, Celeste Yi Ying

    Published 2023
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    Final Year Project (FYP)
  3. 883

    Filament winding of thermoplastic composite pipes for engineering applications by Lim, Samuel

    Published 2023
    “…The aim of this study was to optimize the fabrication process of filament winding of thermoplastic composite pipes through fine-tuning parameters and explore how different fabrication process parameters can potentially affect its final properties. …”
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    Final Year Project (FYP)
  4. 884

    Hierarchical feature attention with bottleneck attention modules for multi-branch classification by Gan, Ryan

    Published 2024
    “…While existing attention mechanisms often focus on pre-processing images, fine-grained classification tasks benefit from leveraging hierarchical relationships within categories. …”
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    Final Year Project (FYP)
  5. 885

    Drawing memories. by Chang, Jerly Wei Kiang.

    Published 2010
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    Final Year Project (FYP)
  6. 886

    XYZ translation by Au, Chong Weng

    Published 2010
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    Final Year Project (FYP)
  7. 887

    The Scene. by Lim, Rachel Shi Ean.

    Published 2010
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    Final Year Project (FYP)
  8. 888

    Design and development of a micromachined vibratory gyroscope with enhanced mechanical sensitivity by Leow, Kok Wah.

    Published 2011
    “…Most of the current research activities in micromachined gyroscope are focusing on the design of a single resonator to increase mechanical sensitivity and performance. These aim to fine tuning the design factors that directly affect the vibration characteristic of the resonator in order to improve the sensitivity. …”
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    Thesis
  9. 889
  10. 890
  11. 891
  12. 892

    Parachute kids by Wah, Hubert Yun Teng

    Published 2013
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    Final Year Project (FYP)
  13. 893

    Coda. by Zurianah Hashim.

    Published 2013
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    Final Year Project (FYP)
  14. 894
  15. 895
  16. 896

    Development of indexing clamper mechanism for wire bonder by Zhang, Yue.

    Published 2008
    “…For wire bonding integrated circuits, the state-of-art is 30 u.m fine pitch, and the position accuracy of material transmission for wire bonder is required to be 3.5 urn or less. …”
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    Thesis
  17. 897
  18. 898
  19. 899
  20. 900

    Package and board level reliability modeling of advanced CSP pakages for telecommunication applications by Tee, Tong Yan

    Published 2008
    “…These technology requirements are possible with the recent development of advanced Chip Scale Packages (CSPs), such as thin-profile fine-pitch Ball Grid Array (TFBGA), Quad-Flat-No-lead (QFN), and wafer-level CSP (WL-CSP). …”
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    Thesis