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    Deep learning based solder joint defect detection on industrial printed circuit board X-ray images by Zhang, Qianru, Zhang, Meng, Gamanayake, Chinthaka, Yuen, Chau, Geng, Zehao, Jayasekara, Hirunima, Woo, Chia-wei, Low, Jenny, Liu, Xiang, Guan, Yong Liang

    Published 2023
    “…With the improvement of electronic circuit production methods, such as reduction of component size and the increase of component density, the risk of defects is increasing in the production line. Many techniques have been incorporated to check for failed solder joints, such as X-ray imaging, optical imaging and thermal imaging, among which X-ray imaging can inspect external and internal defects. …”
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    Journal Article
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