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    Comparison of different molds (epoxy, polymer and silicon) for microfabrication by hot embossing technique by Gupta, A., Tang, P. S., Jena, Rajeeb Kumar, Yue, Chee Yoon, Lam, Yee Cheong

    Published 2013
    “…At the optimum embossing conditions (i.e. 100 °C, 2.94 kN load and 5 min loading time), all three molds had similar performance in terms of replication fidelity. …”
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    Journal Article
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