Showing 141 - 160 results of 291 for search '(((sping OR (ina OR spainae)) OR ((spie OR ssping) OR (pine OR pingge))) OR (pengya OR pin))', query time: 0.18s Refine Results
  1. 141
  2. 142

    Sensing signal conditioning circuit design and analysis for emerging pressure sensing technology by Lim, John Jia Song

    Published 2017
    “…Finally, for the semiconductor piezoresistive strain gage, a Wheatstone bridge circuit used in conjunction with three different signal conditioning circuits were built: the op-amp subtractor, two op-amp INA and three op-amp INA. Transient response and frequency response simulations were then conducted in SPICE to analyze the performance of the circuit in response to a 100Hz sinusoidal signal, mimicking a 100Hz, 0 – 35KPa radial pulse signal. …”
    Get full text
    Final Year Project (FYP)
  3. 143
  4. 144
  5. 145
  6. 146
  7. 147
  8. 148
  9. 149
  10. 150
  11. 151
  12. 152
  13. 153

    Unstable bodies by Goh, Beverly Shing Yi

    Published 2017
    Get full text
    Final Year Project (FYP)
  14. 154

    Convective boiling and condensation in enhanced tubes produced by selective laser melting by Tan, Choon Yong

    Published 2018
    “…The design of the four tubes are five long circumferential pin fins, eight short circumferential pin fins, twisted pin fins and a metallic foam structure. …”
    Get full text
    Final Year Project (FYP)
  15. 155

    Using edge detection and polarimetric imaging for vaccine inspection by Sharan, Praveer, Tellbach, Denise, Sarma, Sanjay E.

    Published 2024
    “…SPIE Smart Structures + Nondestructive Evaluation, 2022, Long Beach, California, United States…”
    Get full text
    Article
  16. 156

    A two-dimensional co-rotational Timoshenko beam element with XFEM formulation by Xu, Jin, Lee, Chi King, Tan, Kang Hai

    Published 2014
    “…Pin connections and plastic hinges produce non-smooth displacement fields in beam structures. …”
    Get full text
    Get full text
    Journal Article
  17. 157

    Study of heat transfer through micro-structured surfaces by Chin, Wei Hao

    Published 2016
    “…Each chip has a different microstructure in the form of very small and elongated pin-fins, which will in turn affect the critical heat flux of each component. …”
    Get full text
    Final Year Project (FYP)
  18. 158
  19. 159
  20. 160