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    Data analytics on maps by Boey, Jackson Ming Hui

    Published 2018
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    Final Year Project (FYP)
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    3D simulation-based research on the effect of interconnect structures on circuit reliability by He, Feifei, Tan, Cher Ming

    Published 2015
    “…This change in failure site can cause mis-interpretation of the EM weak spot location when the line-via structure is used for data extrapolation in predicting the EM reliability of the entire circuit. …”
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    Journal Article