Showing 501 - 520 results of 2,606 for search '(((spinnae OR (vince OR spingae)) OR line) OR ((pinn OR ying) OR (pin OR ming)))', query time: 0.18s Refine Results
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    3D simulation-based research on the effect of interconnect structures on circuit reliability by He, Feifei, Tan, Cher Ming

    Published 2015
    “…The simulation of the EM reliability of the interconnects is usually performed using the line-via structure at the EM test temperature (e.g. 300 oC).However, such simulation using the line-via structure may not give the same void nucleation location as in the real circuit structure, especially at the circuit operation temperature (e.g. 90C). …”
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    Journal Article
  19. 519

    A planar antenna in LTCC for single-package ultrawide-band radio by Chen, Ying, Zhang, Yue Ping

    Published 2009
    “…The antenna has an elliptical radiator fed through a microstrip line. The radiator and the microstrip line share the same ground plane with the other UWB radio circuitry. …”
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    Journal Article
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