Experimental studies on the behaviour of non_seismically detailed reinforced concrete column by Lim, Marvin Wei Sheng.

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Development of a multi-rotor UAV : structural material & key component analysis by Goh, Hung Soon

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Calibration of the basic reinforced concrete design provision (Calibration of bond stress-slip models for unconfined reinforced concrete) by Cheah, Yi Ning

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Study on the effects of indoor air quality on the cognitive abilities of youths in Singapore by Chua, Elena Mei Yan

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Strength improvement by surcharge and vacuum preloading by Lew, Chloe Yan Bin Jmi

“…This study used Kaolin as the sample material to examine the impact of vacuum and surcharge preloading on the undrained shear strength and soil-water characteristic curve of fine-grained soil. Consolidated kaolin samples were trimmed into cylindrical specimens and subjected to different pre-consolidation pressures. …”
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Bi-factorial preference optimization: balancing safety-helpfulness in language models by Zhang, W, Torr, PHS, Elhoseiny, M, Bibi, A

“…Fine-tuning large language models (LLMs) on human preferences, typically through reinforcement learning from human feedback (RLHF), has proven successful in enhancing their capabilities. …”

Effectiveness of product placements in computer games. by Chan, Jesslyn Hor Yee., Chua, Shi Wei., Lim, Chong Tat.

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GPS-based attitude determination and applications by Xia, Peiqing

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Analog smart I/O pads by Tan, Shyue Mei.

“…ESD is an increasingly significant problem in integrated circuit design as increasing pin counts and faster circuit speeds compound the need for more and better reliable ESD protection. …”
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Effect of emulsion temperature on physical properties of palm oil‐based margarine by Miskandar, M. S., Che Man, Y. B., Yusoff, M. S. A., Abdul Rahman, R.

“…The emulsion temperatures studied were 40, 45, and 50°C, with other parameters such as emulsion flow rates, tube cooler temperature, and pin rotor speed kept constant. The SFC developed during processing and storage at 28°C was measured to evaluate the quality of margarine. …”
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Laser-Guide-Star Satellite for Ground-Based Adaptive Optics Imaging of Geosynchronous Satellites by Marlow, Weston, Carlton, Ashley, Hyosang, Yoon, Clark, James, Haughwout, Christian, Cahoy, Kerri, Males, Jared, Close, Laird, Morzinski, Katie

“…The concept for a satellite guide star was first discussed in the literature by Greenaway and Clark in the early 1990s ("PHAROS: An Agile Satellite-Borne Laser Guidestar," Proceedings of SPIE, Vol. 2120, 1994, pp. 206-210), and expanded upon by Albert in 2012 ("Satellite-Mounted Light Sources as Photometric Calibration Standards for Ground-Based Telescopes," Astronomical Journal, Vol. 143, No. 1, 2012, p. 8). …”
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Simultaneous ultraviolet, visible, and near-infrared continuous-wave lasing in a rare-earth-doped microcavity by Jiang, Bo, Zhu, Song, Ren, Linhao, Shi, Lei, Zhang, Xinliang

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Combined ultrasound and photoacoustic imaging of blood clot during microbubble-assisted sonothrombolysis by Das, Dhiman, Pramanik, Manojit

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Low power PWM based sensor readout circuit by He, Shengyu

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Characterization of copper chemical mechanical polishing induced defects by Teo, Tai Yong.

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Interactive analog filter learning tool by Maung Htun Htun Naing.

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Dated by Tan, Ping Hao

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A physical model for sloping capillary barriers by Rahardjo, Harianto, Tami, Denny, Leong, Eng Choon, Fredlund, Delwyn G.

“…A sloping two-layer capillary barrier model consisting of a relatively fine soil layer over a relatively coarse soil layer was constructed inside a specially designed apparatus. …”
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Anomaly detection in aerosol jet printing via computer vision & machine learning by Ang, Ryan Wei Hao

“…The Aerosol Jet Printing (AJP) technique is a relatively new contactless direct write method that is being developed for the purpose of producing fine features on a diverse selection of surfaces. …”
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Flip chip joint-in-via architecture on flexible substrates with Au-Sn interdiffusion bonding by Lee, Teck Kheng

“…Field applications using existing packaging infrastructure has demonstrated the robustness of applying the SLICF bonding with the joint-in-via architecture for fine pitch flip-chip applications.…”
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