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ssping » suping (Expand Search), sspingg (Expand Search), sssping (Expand Search)
ina » aina (Expand Search), nina (Expand Search), dina (Expand Search)
bina » baina (Expand Search), bnina (Expand Search), bdina (Expand Search), bin (Expand Search), bing (Expand Search)
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sline » line (Expand Search), spine (Expand Search), slice (Expand Search)
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Design and investigation of air-cooled heat sinks using 3D printing technology
Published 2016“…This study presents the heat transfer performance of five pin fin heat sinks that have been fabricated using Selective Laser Melting. …”
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Final Year Project (FYP) -
204
Sensing signal conditioning circuit design and analysis for emerging pressure sensing technology
Published 2017“…Finally, for the semiconductor piezoresistive strain gage, a Wheatstone bridge circuit used in conjunction with three different signal conditioning circuits were built: the op-amp subtractor, two op-amp INA and three op-amp INA. Transient response and frequency response simulations were then conducted in SPICE to analyze the performance of the circuit in response to a 100Hz sinusoidal signal, mimicking a 100Hz, 0 – 35KPa radial pulse signal. …”
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Final Year Project (FYP) -
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Challenges faced by women in the corporate world
Published 2008Get full text
Final Year Project (FYP) -
207
Comparative study of accounting standards between Singapore and the Peoples' Republic of China
Published 2008Get full text
Final Year Project (FYP) -
208
Magical portal : connecting with imaginary worlds
Published 2016Get full text
Final Year Project (FYP) -
209
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Convective boiling and condensation in enhanced tubes produced by selective laser melting
Published 2018“…The design of the four tubes are five long circumferential pin fins, eight short circumferential pin fins, twisted pin fins and a metallic foam structure. …”
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Final Year Project (FYP) -
211
A two-dimensional co-rotational Timoshenko beam element with XFEM formulation
Published 2014“…Pin connections and plastic hinges produce non-smooth displacement fields in beam structures. …”
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Journal Article -
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Study of heat transfer through micro-structured surfaces
Published 2016“…Each chip has a different microstructure in the form of very small and elongated pin-fins, which will in turn affect the critical heat flux of each component. …”
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Final Year Project (FYP) -
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