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    Microstructured BN composites with internally designed high thermal conductivity paths for 3D electronic packaging by He, Hongying, Peng, Weixiang, Liu, Junbo, Chan, Xin Ying, Liu, Shike, Lu, Li, Le Ferrand, Hortense

    Published 2022
    “…Indeed, prompt heat dissipation in electrically insulating packaging is currently limited by the thermal conductivity achieved by thermal interface materials (TIMs) and by their capability to direct the heat towards heat sinks. Here, we create high thermal conductivity BN-based composites able to conduct heat intentionally towards specific areas by locally orienting magnetically functionalized BN microplatelets using magnetically assisted slip casting (MASC). …”
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    Journal Article
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