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ada » pada (Expand Search), adam (Expand Search)
bond » bound (Expand Search), band (Expand Search)
pace » space (Expand Search), face (Expand Search), page (Expand Search)
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Development of indexing clamper mechanism for wire bonder
Published 2008“…For wire bonding integrated circuits, the state-of-art is 30 u.m fine pitch, and the position accuracy of material transmission for wire bonder is required to be 3.5 urn or less. …”
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