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  1. 1

    Development of indexing clamper mechanism for wire bonder by Zhang, Yue.

    Published 2008
    “…For wire bonding integrated circuits, the state-of-art is 30 u.m fine pitch, and the position accuracy of material transmission for wire bonder is required to be 3.5 urn or less. …”
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    Thesis
  2. 2

    Data mining applications in Singapore by Ang, Chung Lay, Loh, Heng Meng, Tham, Tuck Kong

    Published 2013
    “…With the ever increasing pace oftechnological advancement, data acquisition has become amazingly easy and painless. …”
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    Final Year Project (FYP)
  3. 3

    Towards in-network machine learning on programmable network devices by Zheng, C

    Published 2024
    “…In-network computing is a promising and scalable solution, capable of processing packets in-band at the pace of data generation and facilitating early termination of traffic. …”
    Thesis
  4. 4

    EEG based brain signal analysis on stress level by Ng, Yu Xin

    Published 2017
    “…In this fast pace world, one must complete multiple jobs at the same time. …”
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    Final Year Project (FYP)