Bond order resolved 3d 5/2 and valence band chemical shifts of Ag surfaces and nanoclusters by Sun, Changqing, Qin, Wei, Wang, Yan, Huang, Yongli, Zhou, Zhaofeng, Yang, Chao

“…It is clarified that the globally positive energy shifts originate from the undercoordination-induced Goldschmidt–Pauling bond contraction and the associated local quantum entrapment and the heterocoordination-induced bond nature alteration at the particle–substrate interfaces. …”
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Electrical tunable topological valley photonic crystals for on-chip optical communications in the telecom band by Qi, Zhipeng, Hu, Guohua, Deng, Chunyu, Sun, Hao, Sun, Yaohui, Li, Ying, Liu, Bo, Bai, Yu, Chen, Shuaidong, Cui, Yiping

“…On-chip optical communications are in increasingly demand for low-loss, small-footprint and power-efficient waveguiding solutions in the telecom band. However, most integrated optical circuits suffer from high propagation loss and low integration degree. …”
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Programmable interfacial band configuration in WS2/Bi2O2Se heterojunctions by Zhang, Hanwen, Fu, Jianhui, Carvalho, Alexandra, Poh, Eng Tuan, Chung, Jing-Yang, Feng, Minjun, Chen, Yinzhu, Wang, Bo, Shang, Qiuyu, Yang, Hengxing, Zhang, Zheng, Lim, Sharon Xiaodai, Gao, Weibo, Gradečak, Silvija, Qiu, Cheng-Wei, Lu, Junpeng, He, Chunnian, Sum, Tze Chien, Sow, Chorng Haur

“…A crucial factor determining the light-material interaction is in the band alignment at the heterojunction interface, particularly the distinctions between type-I and type-II alignments. …”
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Rapid defect detections of bonded wafer using near infrared polariscope by Asundi, Anand Krishna, Ng, Chi Seng

Subjects: “…Bonded interface…”
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Plasmonic semiconductor nanogroove array enhanced broad spectral band millimetre and terahertz wave detection by Tong, Jinchao, Suo, Fei, Zhang, Tianning, Huang, Zhiming, Chu, Junhao, Zhang, Dao Hua

“…In addition, such a single device can perform broad spectral band detection from 0.9 mm (0.330 THz) to 9.4 mm (0.032 THz). …”
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Developing a system that uses ultrawide-band inertial measurement units to quantify selected 10-Pin skills in real-time by Wee, Joel Jiewei

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Quantum scale biomimicry of low dimensional growth : an unusual complex amorphous precursor route to TiO2 band confinement by shape adaptive biopolymer-like flexibility for energy... by Choi, Dahyun, Sonkaria, Sanjiv, Fox, Stephen John, Poudel, Shivraj, Kim, Sung-yong, Kang, Suhee, Kim, Seheon, Verma, Chandra, Ahn, Sung Hoon, Lee, Caroline Sunyong, Khare, Varsha

“…Further, we show the change in optoelectronic properties under quantum confinement is intrinsically related to size that affects their optical absorption band energy range in DSSC.…”
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Bond strength of 3D printed concrete by Panda, Biranchi, Tay, Daniel Yi Wei, Ting, Andrew Guan Heng, He, Lewei, Tan, Ming Jen

“…In this paper, the authors investigate the possibility of improving the interface bond strength of this layer by layer construction technique. …”
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Critical temperatures in thermocompression gold stud bonding by Zhang, G. G., Ang, X. F., Chen, Z., Wong, Chee C., Wei, J.

“…This is supported by the observation on the interfacial shear stress distribution at the bonding interface based on finite element simulation models of substrates with different hardness.…”
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Low temperature Cu-Cu thermo-compression bonding with temporary passivation of self-assembled monolayer and its bond strength enhancement by Ang, X. F., Wei, J., Leong, K. C., Tan, Chuan Seng, Lim, Dau Fatt

“…After 3 days of storage, the temporary SAM layer is desorbed with in situ anneal in inert ambient to uncover the clean Cu surface. A pair of wafers is bonded at 250 °C. Clear evidences of in-plane and out-of-plane Cu grain growth are observed resulting in a wiggling bonding interface. …”
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Dynamic fracture mechanics of FRP-concrete interface by Li, Gen

“…Due to the inconsistent deformation in concrete and FRP laminate, relative slip and corresponding shear stress is created between the concrete and FRP and the bond of the interface eventually fails by shear debonding. …”
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Evaluation of process requirements for room temperature direct copper bonding by Chen, Qiang.

“…The ultrathin (1-3 nm) organic monolayer structure, as compared to a bulk oxide layer, could be easily displaced during the mechanical deformation at the bonding interface. Preliminary results have shown copper samples bond even at room temperature with SAMs. …”
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Interface energetics and dynamics in organic-inorganic hybrid perovskites by Goh, Teck Wee

“…This thesis is dedicated to address these issues. Firstly, the interface energetics of FAPbI3-based perovskites with organic charge extraction layers showed apparent upward band bending, but its origin is unexpectedly due to presence of δ-FAPbI3. …”
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Multi-class classification of EEG in a brain-computer interface by Chong, Cherrie Ning Hui

“…For binary classification of up v.s. left, the delta and theta bands comprised a larger proportion of best features selected, and similarly with the alpha band for classification of up v.s. right.…”
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Interface engineering for organic−inorganic hybrid perovskite solar cells by Foo, Shini

“…Owing to ionic and soft bonding characteristics of OIHP materials, defects such as under−coordinated ions and dangling bonds tend to concentrate at the OIHP/HTL interface. …”
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Thermal shock resistance enhancement by improved interfacial bonding for carbon/aluminium composites by Wei, Wenfu, Huang, Zhanglin, Yin, Guofeng, Yang, Zefeng, Li, Xiaobo, Zuo, Haozi, Deng, Qin, Huang, Guizao, Ren, Junwen, Liao, Qianhua, Yang, Yan, Wu, Guangning

“…However, the unstable bonding of the C/Al interface and significant thermal expansion differences have resulted in risks of the composites' failure once suffering from severe thermal shock. …”
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Ultrsonic testing of bond integrity in adhesive joints between 2 similar metals by Ang, Marcus

“…In the presence of a cohesive bond at the adhesive-adherend interface, the A-scan is able to pick up the adhesive signals during ultrasonic testing. …”
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Two-dimensional transitional metal dichalcongenide heterostructures : interface optical properties by Zheng, ShouJun

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Flip chip joint-in-via architecture on flexible substrates with Au-Sn interdiffusion bonding by Lee, Teck Kheng

“…A new joint-in-via architecture has been developed with an instantaneous fluxless bonding know as SLICF (solid-liquid interdiffusion bonding by compressive force) for fine pitch microelectronic packaging. …”
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Experimental characterization and modeling of the mechanical properties of Cu–Cu thermocompression bonds for three-dimensional integrated circuits by Made, Riko I., Thompson, Carl V., Gan, Chee Lip, Yan, Li Ling, Kor, Katherine Hwee Boon, Chia, Hong Ling, Pey, Kin Leong

“…Shear strength measurements were used to characterize the effects of the bonding parameters on the interface bond strength. …”
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