Does Increased Competition Affect Credit Ratings? A Reexamination of the Effect of Fitch’s Market Share on Credit Ratings in the Corporate Bond Market by Bae, Kee-Hong, Kang, Jun-Koo, Wang, Jin

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Characterisation of rainfall rate and rain attenuation at Ku-band for earth-space communication by Zhu, Chun Ning.

“…Based on the need for a critical assessment of the impact of rain on the operation of Ku-band satellite services in Singapore, studies have been done to characterise rainfall rate and rain attenuation at Ku-band.…”
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The natural rate of output, supply-side potential and the long-term sustainable growth band for the Singapore economy by Joseph Edison Junior

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The impacts of US Fed interest rate liftoff on Southwest Asia stock markets, sovereign bond and currencies by Ooi, Teik Khim

“…This paper aims to examine the impact of US interest rate lift-off on the performance of ASEAN equities, currencies and sovereign bond during that period. …”
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Hedging interest rate risk using simple, covariance-adjusted and volatility-adjusted immunization strategies : Japanese government bonds : April 1989 to December 2000 by Lim, Ming Siang, Wee, Hans Hang Leong, Poh, Leong Poh

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Design and implementation of multi-mode variable bit-rate modulator and high bit-rate demodulator for low earth orbit satellites by Tai, Wei Chua

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Performance analysis of impulse-radio ultra-wideband techniques for low-rate communications by Cui, Shan

“…Impulse-radio (IR) ultra-wideband (UWB) has drawn much attention as a promising technology for low-data-rate applications such as ranging, identification and low-rate communication in sensor networks. …”
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Bit-error rate simulation for frequency-hopped multiple-access systems over fading channels by Le, Thi Ngoc Anh.

“…In this report, bit-error-rate (BER) performance of a fast frequency-hopped binary frequency-shift-keying (FFH/BFSK) system using diversity-combining over multiple-access interference (MAI), partial-band jamming (PBJ), additive white Gaussian noise (AWGN) and fading channels is presented. …”
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Plastic Instability in Co-Cr-Ni-Mo alloy wires drawn with different drawing practices by GVK, Sai Srikanth, Tan, Ming Jen, Liu, Zhenyun

“…The wires were subjected to different plastic deformations, by varying the amount of cold work (CW) reduction, and the strain hardening exponent (γ) and strain rate sensitivity (m) were determined from the logarithmic plots of the true stress and strain curves. …”
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Essays on the market for corporate bonds by Levonmaa, A

“…Chapter 1 studies the impact of credit rating changes on corporate bond returns. This study uses a large dataset of corporate bond transactions from the TRACE database for the US corporate bond market, combined with credit rating changes from Fitch, Moody's and Standard and Poor's (S&P), to analyse over 22,000 bonds, coupled with approximately 28,400 rating events over nearly six years. …”

Development of the bond markets in Singapore and Malaysia. by Chan, Wei Lun.

“…The study also explores avenues for increasing the demand for corporate bonds such as increasing provident fund investments in bonds; changes to the commission rate structure for bond trading, and reduction or abolition of tax for interest received and stamp duty transferances. …”
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Social bonds and community support are vital to prison reform by Newson, M, Whitehouse, H

“…This research highlights the importance of fostering positive group bonds and community support to enhance reintegration efforts and reduce reoffending rates.…”

Social bonding among children in joint physically active play by Jefferies, M

“…PA levels were also measured indirectly via heart rate monitors (HRM). We found that observed-PA was associated with frequency of smiling/laughing between pairs. …”

Cerium oxide for L-band Q-switched pulse laser generation by Mansor, M., Zainol Abidin, N.H., Ng, E.K., Garg, A.K., Liew, J.Y.C., Alresheedi, M.T., Mahdi, M.A.

“…Within 33.33 mW to 153.20 mW pump power range, the Q-switched laser obtained pulse repetition rates between 11.00 to 34.48 kHz, and pulse widths between 39.0 to 12.0 µs, with a high maximum pulse energy of 410 nJ. …”
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An Ultra-Wideband Antenna with Triple Band-Notched Characteristics for Wearable Application by Rashid, M. A. A, Shah, S. M, Majid, H. A, Musa, U, Suriani, N. S

“…Nevertheless, the antenna is able to reject the WiMAX and C-band as well as the WLAN band. The simulated specific absorption rate (SAR) results show that the antenna complies with the SAR limit Federal Communication Commission (FCC) and International Commission of Non-Ionizing Radiation Protections (ICNIRP) standards for 1 mW input power. …”
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Hydrogen-bond memory and water-skin supersolidity resolving the Mpemba paradox by Zhang, Xi, Huang, Yongli, Ma, Zengsheng, Zhou, Yichun, Zhou, Ji, Zheng, Weitao, Jiang, Qing, Sun, Changqing

“…Analysis of experimental database reveals that the hydrogen bond (O:H–O) possesses memory to emit energy at a rate depending on its initial storage. …”
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Design of an oil-immersed pulse modulator for X-band 50-MW klystron by Liu, Yong-Fang, Matsumoto, Hiroshi, Gu, Ming, Li, Guo-Qiang, Li, Sheying

“…This article presents a compact high-voltage pulse modulator used for a 50-MW X -band pulsed klystron (11.4 GHz) at Shanghai Advanced Research Institute, Chinese Academy of Sciences (SARI, CAS). …”
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QoS provisioning by power control for video communication via satellite links by Ma, Ting, Lee, Yee Hui, Winkler, Stefan, Ma, Maode

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Electrical tunable topological valley photonic crystals for on-chip optical communications in the telecom band by Qi, Zhipeng, Hu, Guohua, Deng, Chunyu, Sun, Hao, Sun, Yaohui, Li, Ying, Liu, Bo, Bai, Yu, Chen, Shuaidong, Cui, Yiping

“…Furthermore, an extreme high data rate of 100 Gbit/s is demonstrated with such topological waveguide by wavelength division multiplexing. …”
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Flip chip joint-in-via architecture on flexible substrates with Au-Sn interdiffusion bonding by Lee, Teck Kheng

“…A new joint-in-via architecture has been developed with an instantaneous fluxless bonding know as SLICF (solid-liquid interdiffusion bonding by compressive force) for fine pitch microelectronic packaging. …”
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