Showing 361 - 380 results of 6,114 for search '((cars OR chen) OR (seeds OR ((((bears OR nears) OR (beads OR leads)) OR beam) OR bear)))', query time: 0.22s Refine Results
  1. 361

    Plasmonic properties of two-dimensional metallic nanoholes fabricated by focused ion beam lithography by Zhu, Shaoli, Zhou, Wei

    Published 2013
    “…We used the finite-difference time-domain method to design the transmission and the localized surface plasmon resonance electric field distribution in the near field. The focused ion beam method was used to fabricate the nanoholes. …”
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    Journal Article
  2. 362
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    Renal-clearable molecular probe for near-infrared fluorescence imaging and urinalysis of SARS-CoV-2 by Liew, Si Si, Zeng, Ziling, Cheng, Penghui, He, Shasha, Zhang, Chi, Pu, Kanyi

    Published 2022
    “…Real-time imaging of protease activity specific to SARS-CoV-2 can overcome these issues but remains lacking. Herein, we report a near-infrared fluorescence (NIRF) activatable molecular probe (SARS-CyCD) for detection of SARS-CoV-2 protease in living mice. …”
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    Journal Article
  5. 365

    Simultaneous ultraviolet, visible, and near-infrared continuous-wave lasing in a rare-earth-doped microcavity by Jiang, Bo, Zhu, Song, Ren, Linhao, Shi, Lei, Zhang, Xinliang

    Published 2023
    “…By this method, an Er-Yb co-doped silica microsphere cavity with the highest quality (Q) factor (exceeding 108) among the rare-earth-doped microcavities is fabricated to demonstrate simultaneous and stable lasing covering ultraviolet, visible, and near-infrared bands under room temperature and a continuous-wave pump. …”
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    Journal Article
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    Laser-based 3D printing using bessel beams for tissue engineering applications by Liew, Andy Wen Loong

    Published 2020
    “…In this dissertation, a laser-based 3D printing technique using Bessel Beams was studied for applications in tissue engineering. …”
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    Thesis-Doctor of Philosophy
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    Rigid-elastic combined metamaterial beam with tunable band gaps for broadband vibration suppression by Zhang, Jiazhen, Peng, Xuzhang, Yu, Dewen, Hu, Guobiao, Yang, Yaowen

    Published 2024
    “…Extensive research efforts have been dedicated to exploring the application of metamaterial beams for vibration suppression. However, most existing designs primarily focused on utilizing the translational motion of local resonators to create band gaps. …”
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    Journal Article
  13. 373

    High-strength concrete deep beams with different web reinforcements under combined loading by Weng, Li Wei.

    Published 2009
    “…The investigations described in this thesis are principally concerned with the general behaviour, analysis and design in shear of reinforced concrete deep beams subjected to combined loading with various top to bottom loading ratios. …”
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    Thesis
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    A compact 2 degree-of-freedom energy harvester with cut-out cantilever beam by Wu, Hao, Tang, Lihua, Yang, Yaowen, Soh, Chee Kiong

    Published 2013
    “…The harvester comprises one main cantilever beam and one secondary cantilever beam cut out within the main beam. …”
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    Journal Article
  16. 376

    Mixed lead-tin perovskite films with >7 μs charge carrier lifetimes realized by maltol post-treatment by Hu, S, Truong, MA, Otsuka, K, Handa, T, Yamada, T, Nishikubo, R, Iwasaki, Y, Saeki, A, Murdey, R, Kanemitsu, Y, Wakamiya, A

    Published 2021
    “…Mixed lead–tin (Pb–Sn) halide perovskites with optimum band gaps near 1.3 eV are promising candidates for next-generation solar cells. …”
    Journal article
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    A low-profile three-dimensional neural probe array using a silicon lead transfer structure by Cheng, Ming-Yuan, Je, Minkyu, Tan, Kwan Ling, Tan, Ee Lim, Lim, Ruiqi, Yao, Lei, Li, Peng, Park, Woo-Tae, Phua, Eric Jian Rong, Gan, Chee Lip, Yu, Aibin

    Published 2013
    “…This paper presents a microassembly method for low-profile three-dimensional probe arrays for neural prosthesis and neuroscience applications. A silicon (Si) lead transfer structure, Si interposer, is employed to form electrical connections between two orthogonal planes—the two dimensional probes and the dummy application-specific integrated circuit (ASIC) chip. …”
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    Journal Article
  20. 380