Degradation model of a linear-mode LED driver and its application in lifetime prediction by Lan, Song, Tan, Cher Ming

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Fracture toughness assessment of a solder joint using double cantilever beam specimens by Lee, Adeline Puay Chen, Lim, Zan Xuan, Yantara, Natalia, Loo, Shane Zhi Yuan, Tee, Tong Yan, Tan, Cher Ming, Chen, Zhong

“…Conventional assessment of solder joint reliability uses either ball shear test or solder ball pull test. The test results are reported in terms of materials strength in either shear or tensile mode, and the strength values are size-dependent. …”
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Effect of deep cold rolling on residual stress distributions between the treated and untreated regions Ti–6Al–4V alloy by Lim, Andre, Castagne, Sylvie, Chow, Cher Wong

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Temperature and stress distribution in the SOI structure during fabrication by Tan, Cher Ming, Gan, Zhenghao, Gao, Xiaofang

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Comparison of diagnostic performance and inter-reader agreement between PI-RADS v2.1 and PI-RADS v2: systematic review and meta-analysis by Lee, Chau Hung, Vellayappan, Balamurugan, Tan, Cher Heng

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The happiness revolution : live life now. by Hong, Shuqi., Cher, Fiona., Lin, Huanyu., Rusydi, Izzat.

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Erasure temperature measurements of heat assisted magnetic recording media by Chen, Y. J., Yang, H. Z., Leong, S. H., Cher, K. M., Hu, J. F., Sethi, P., Lew, Wen Siang

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Characterization techniques for power semiconductor and magnetic drives by Tseng, King Jet, Foo, Chek Fok, Tan, Cher Ming

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A study of management control systems in multinational corporations : a Singapore perspective by Ang, Cher Boon, Gan, Siok Hoon, Yip, Pei Wai

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Marketing on internet :case studies on Singapore companies. by Cher, Ming Hui., Chow, Hui Woon., Teo, Cheng Hoon.

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The four mini dragons by Ding, See Yue, Leo, Cher Ling, Seah, Boon Hock

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The impact of information technology on banking services in Singapore by Ang, Cher Hao, Quah, Kwee Seng, Teo, Shann Wei

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The influence of flexible working arrangements on employee turnover intention by Bhasin Yuvraj Vijay, Yang, Cher Ming, Chan, Ngok Chuin

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Textile industry in Singapore : the relationship between fringe benefits and industry performance by How Wen-Li Lorraine, Lim Sheau Huei, Tan Cher Ting

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Additive manufacturing of multiple materials by selective laser melting : Ti-alloy to stainless steel via a Cu-alloy interlayer by Tey, Cher Fu, Tan, Xipeng, Sing, Swee Leong, Yeong, Wai Yee

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21A.100 Introduction to Anthropology, Fall 2004 by Howe, James

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Ab initio simulation of electronic and mechanical properties of aluminium for fatigue early feature investigation by Zhang, Shuai, Tan, Cher Ming, Cheng, Shuguang, Deng, Tianqi, He, Feifei, Su, Haibin

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Creep mitigation in Sn–Ag–Cu composite solder with Ni-coated carbon nanotubes by Nai, S. M. L., Xu, L. Y., Wei, J., Han, Yongdian, Jing, Hongyang, Tan, Cher Ming

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Practical attribute reconstruction attack against federated learning by Chen, Chen, Lyu, Lingjuan, Yu, Han, Chen, Gang

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Evaluation of process requirements for room temperature direct copper bonding by Chen, Qiang.

“…In this thesis, by coating the copper surface with a self assembled monolayer of alkanethiol prior to bonding, Cu joints can be successfully formed at room temperature in ambient environment, yielding joint shear strength up to 60MPa. Copper bond shear strength of 15 MPa is achieved even at 50MPa at 25°C with copper coated with C18. …”
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