Conformational design characterization of a truncated diamine oxidase by Razali, Nur Nadia

“…Being a large protein,DAO is more susceptible to destabilising agents such as heat and pH, similar to other large proteins. Due to the large structure of native diamine oxidase, researchers are being actively conducted to develop a more versatile, and stable protein because big molecules do not perform well in microsystem. …”
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Physiological stress responses and meat quality of rabbits subjected to different road transportation and slaughter methods by Khadijah, Nakyinsige

“…Transportation caused a significant rise in aspartate aminotransferase (AST), alanine aminotransferase (ALT) and creatine kinase (CK) activities, packed cell volume, haematocrit, plasma protein, glucose,lactate, corticosterone, live weight loss and the expression of heat shock protein 70 (T3 > T2 > T1, p<0.05). At d 0, the pre-rigor pH (pHi) and muscle glycogen were not significantly different among treatments but at days 1 and 7, the pH significantly increased (T3 > T2 > T1, p<0.05) while glycogen significantly reduced (T3 < T2 < T1, p<0.05) with transit time. …”
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Engineered terahertz emission from spintronic heterostructures: amplitude, phase and chirality by Agarwal, Piyush

“…We demonstrated that due to the electron-phonon heat thermalization, the lattice experiences an abrupt decrease in magnetic anisotropy within a few picoseconds, 10 which cause an ultrafast shrink in magnetic coercivity. …”
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Energy-efficient hardware accelerators based on bit-serial graph and memory-centric computing architectures by Mu, Junjie

“…Partial differential equations (PDEs) are widely used in physics and engineering, such as heat conduction, fluid mechanics and electrodynamics, and quantum mechanics. …”
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Introductory Chemical Engineering Thermodynamics / by Elliott, J. Richard, author 466041, Lira, Carl T., author 323516

Failure analysis and characterization for microelectronic packaging by Lin, Pamela

“…Thermal problems such as the silicon (Si) substrate cracking and interfacial delamination are increasingly dominant due to the presence of high heat density in the small multilayer IC packaging. …”
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Pnictogen-halide semiconductors for photovoltaics by Liu, P

“…The effect of antisolvent treatment and precursor/substrate pre-heating temperature, as well as the annealing temperature on the final morphology of the films prepared were investigated. …”

Next generation design of floating systems for coastal solar farms by Bi, Cheng

“…The solar irradiation over the PV panels is calculated considering the dynamic change of their tilt angles along with the platform motion under wave action, and the operational temperature of the PV panels is estimated based on the heat transfer with the ambient water underneath. …”
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Surface engineering to manipulate solar energy for thermal management by Fei, Jipeng

“…Furthermore, we demonstrated significant thermal management by applying a designed coating with both radiative cooling and solar heating functions. The main contribution of this work is verification of the effective liquid matching method for optical regulation, which pushed the optical contrast to an extreme value that could facilitate both optical and thermal management. …”
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Reduced cell and stack modeling of planar solid oxide fuel cells by He, Zhongjie

“…The variation in the pathways of conductive heat transfer between the flow field and adjacent layers is captured by functional correlation factors that are derived based on a Laplace equation. …”
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Investigations into femtosecond laser hybrid manufacturing for 3D power sources by Tham, Nicholas Cheng Yang

“…With these parameters, localised PG (LPG) from PI can be fabricated in-situ without causing damage to the electronics substrate below from excessive heating. Thermochromic paper, which changes colour above a defined temperature is used to validate the model. …”
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Fabrication and characterization of Algan/Gan high electron mobility transistors on silicon by Tham, Wai Hoe

“…Nevertheless with the mitigation of self-heating, GaN-on-SOI substrates is deemed to be an excellent alternative in the Si integration technology. …”
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