Showing 161 - 180 results of 11,796 for search '((checked OR ((cheer OR (chen OR when)) OR chee)) OR ((beers OR peer) OR bears))', query time: 0.41s Refine Results
  1. 161

    Customized glass sealant for ceramic substrates for high temperature electronic application by Sharif, Ahmed, Gan, Chee Lip, Chen, Zhong

    Published 2014
    “…The glass joints in both the Al2O3/glass/Al2O3 and AlN/glass/AlN systems maintained their integrity even when shear-tested at 250 °C. The results of the mechanical and microstructural characterizations demonstrate that Bi-based two phase glass frit bonding is an effective ceramic bonding method for harsh-environment electronic packaging.…”
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    Journal Article
  2. 162
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  7. 167

    Critical temperatures in thermocompression gold stud bonding by Zhang, G. G., Ang, X. F., Chen, Z., Wong, Chee C., Wei, J.

    Published 2012
    “…A critical bonding temperature was observed for both substrates. No bonding occurs when the temperature is below this threshold value, whereas bond strength increases with bonding temperature beyond the threshold. …”
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    Journal Article
  8. 168
  9. 169

    Okara: a promising resource for novel bioflocculant synthesis by Agustin, Yuana Elly, He, Ning, Yeap, Swee Keong, Luthfi, Abdullah Amru Indera, Ding, Gongtao, Abdul, Peer Mohamed, Abdul Manaf, Shareena Fairuz, Jamali, Nur Syakina, Chen, Binghui, Tan, Jian Ping

    Published 2024
    “…The result showed that the use of okara as an alternative substrate resulted in 89.2 % flocculation activity of the kaolin suspension when Ca2+ was used as a coagulant and pH was 12. …”
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    Article
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    A local product-of-exponentials method for the kinematic calibration of modular reconfigurable robots by Tan, Chee Tat.

    Published 2008
    “…Kinematic calibration is a process to identify and compensate for these inherent errors, through model modification, and thus can improve the absolute positioning accuracy of the robot. Similarly when applied for industrial robotics, kinematic calibration serves as a tool for improving the robot accuracy to its system repeatability. …”
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    Thesis
  12. 172

    Study on localized ion transportation phenomena in YSZ at high temperature by Ng, Chee Seng

    Published 2017
    “…Pt-metal AFM probes were fabricated for better resistance towards thermal degradation when in contact with high temperature thin film surface. …”
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    Thesis
  13. 173
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  15. 175

    Simulation and result analysis of digital signal processing related algorithms using MATLAB by Koh, Chee Meng.

    Published 2011
    “…Siferd’s approximation, Zhijun Li, Jianping An, Miao Tang and Jing Yang’s approximation and Tso-Bing Juang, Sheng-Hung Chen and Huang-Jia Cheng’s approximation. In addition, this report also covers the methodology of how these logarithmic approximations are modeled using MATLAB. …”
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    Final Year Project (FYP)
  16. 176
  17. 177

    Laser assisted micro patterning atop shape memory polymer by Goh, Chee Siew.

    Published 2009
    “…When a Shaped Memory Polymer (SMP) is subjected to external factors like heat, light, moisture etc, it will activate the Shape Memory Effect (SME). …”
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    Final Year Project (FYP)
  18. 178

    Activity recognition from inertial sensors on a smartphone by Chee, Kok Hao

    Published 2015
    “…In healthcare sector, getting to track the activity patterns of an individual is vital when providing assistance in healthcare. In this project, unobtrusive finding of a person’s activities is implemented through a smart phone. …”
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    Final Year Project (FYP)
  19. 179

    Peace. by Ong, Chee Wee.

    Published 2012
    “…Slowly and deeply its roots grow, into the hearts that it vowed to shade and protect, hoping that one day they will learn the act of sacrifice. And when that time comes, the magnificent tree will bow one last time, giving way to the young ones that will take its place. …”
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    Final Year Project (FYP)
  20. 180

    An experimental investigation of the elastic stress investigation on crack branching in fiber-reinforced composites by Ng, Chee Yong

    Published 2014
    “…The crack will propagate when the stress factor exceed the stress intensity factor result to the failure of the part. …”
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    Final Year Project (FYP)