Robot perception for object handling by Seah, Brian Yee Chuen

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Seismic velocities in porous rocks : direct and inverse problems/ by Cheng, Chuen Hon Arthur.

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Identifying geodesic acoustic modes in WEST tokamak plasmas by Soh, Kerwin Chuen Han

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Customized glass sealant for ceramic substrates for high temperature electronic application by Sharif, Ahmed, Gan, Chee Lip, Chen, Zhong

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3D simulation-based research on the effect of interconnect structures on circuit reliability by He, Feifei, Tan, Cher Ming

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Degradation model of a linear-mode LED driver and its application in lifetime prediction by Lan, Song, Tan, Cher Ming

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A memory-efficient high-throughput architecture for lifting-based multi-level 2-D DWT by Hu, Yusong, Jong, Ching Chuen

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A high-throughput VLSI architecture for real-time full-HD gradient guided image filter by Wu, Lei, Jong, Ching Chuen

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Non-iterative division circuit design with accuracy and performance trade-off based on mixed integer linear programming approach by Wu, Lei, Jong, Ching Chuen

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Biofilms: Microbial Cities Wherein Flow Shapes Competition by Chew, Su Chuen, Yang, Liang

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Validation and calibration of soil moisture using soil moisture and ocean salinity satellite data in Malaysia / by Kang, Chuen Siang, 1987-, author 615143

Development of multicolor array photodetectors by Chan, Yuen Chuen, Lam, Yee Loy

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Efficient heralding of passively spatial-multiplexed o-band photons for noise-tolerant quantum key distribution by Liu, Mao Tong, Lim, Han Chuen

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Functional area lower bound and upper bound on multicomponent selection for interval scheduling by Shen, Zhao Xuan, Jong, Ching Chuen

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Fracture toughness assessment of a solder joint using double cantilever beam specimens by Lee, Adeline Puay Chen, Lim, Zan Xuan, Yantara, Natalia, Loo, Shane Zhi Yuan, Tee, Tong Yan, Tan, Cher Ming, Chen, Zhong

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Business study mission : Ireland cultural intelligence, Huawei Technologies Co. Ltd by Chen, Fang, Endang Astharanti, Waizly Darwin, Chua, Dennis Chee Cheong

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Effect of chain length on low temperature gold-gold bonding by self assembled monolayers by Ang, X. F., Chen, Z., Wong, Chee C., Wei, J.

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Effect of deep cold rolling on residual stress distributions between the treated and untreated regions Ti–6Al–4V alloy by Lim, Andre, Castagne, Sylvie, Chow, Cher Wong

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Temperature and stress distribution in the SOI structure during fabrication by Tan, Cher Ming, Gan, Zhenghao, Gao, Xiaofang

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Comparison of diagnostic performance and inter-reader agreement between PI-RADS v2.1 and PI-RADS v2: systematic review and meta-analysis by Lee, Chau Hung, Vellayappan, Balamurugan, Tan, Cher Heng

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