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121
Fracture toughness assessment of a solder joint using double cantilever beam specimens
Published 2010“…Conventional assessment of solder joint reliability uses either ball shear test or solder ball pull test. The test results are reported in terms of materials strength in either shear or tensile mode, and the strength values are size-dependent. …”
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Conference Paper -
122
Standardized signature algorithms on ultra-constrained 4-bit MCU
Published 2013Get full text
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Conference Paper -
123
The effect of the union paper case on stock price and volume behaviour of Malaysian stocks
Published 2014Get full text
Final Year Project (FYP) -
124
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125
Influence of thermal sintering protocol on materials properties of tungsten carbide alloy (WC-17%Co) components by binder jet printing
Published 2020Get full text
Final Year Project (FYP) -
126
Investigation of implementation of solar thermal energy on electric power system of Singapore
Published 2012Get full text
Final Year Project (FYP) -
127
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128
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129
Temperature and stress distribution in the SOI structure during fabrication
Published 2009Get full text
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Journal Article -
130
Authorised trading centres - an exploratory study
Published 2014Get full text
Final Year Project (FYP) -
131
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132
Watch this space! A publicity & promotional campaign for Nanyang Technological University's minors and global immersion programmes.
Published 2008Get full text
Final Year Project (FYP) -
133
Outward Japanese manufacturing foreign direct investment in Asia : from an industry-level perspective
Published 2008Get full text
Final Year Project (FYP) -
134
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135
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136
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137
Erasure temperature measurements of heat assisted magnetic recording media
Published 2015Get full text
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Journal Article -
138
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139
Characterization techniques for power semiconductor and magnetic drives
Published 2008Get full text
Research Report -
140
A study of management control systems in multinational corporations : a Singapore perspective
Published 2013Get full text
Final Year Project (FYP)