Semiconductor quantum well irradiated by a two-mode electromagnetic field as a terahertz emitter by Mandal, Subhaskar, Liew, Timothy Chi Hin, Kibis, Oleg V.

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Spin Order and Phase Transitions in Chains of Polariton Condensates by Ohadi, H., Ramsay, A. J., Sigurdsson, H., del Valle-Inclan Redondo, Y., Tsintzos, S. I., Hatzopoulos, Z., Liew, Timothy Chi Hin, Shelykh, I. A., Rubo, Y. G., Savvidis, P. G., Baumberg, J. J.

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Additive manufacturing of electrochemical interfaces : simultaneous detection of biomarkers by Ho, Eugene Hong Zhuang, Ambrosi, Adriano, Pumera, Martin

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Theoretical Modelling and Facile Synthesis of a Highly Active Boron-Doped Palladium Catalyst for the Oxygen Reduction Reaction by Vo Doan, Tat Thang, Wang, Jingbo, Poon, Kee Chun, Tan, Desmond Chun Long, Khezri, Bahareh, Webster, Richard David, Su, Haibin, Sato, Hirotaka

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Nonlinear metasurface for simultaneous control of spin and orbital angular momentum in second harmonic generation by Li, Guixin, Wu, Lin, Li, King F., Chen, Shumei, Schlickriede, Christian, Xu, Zhengji, Huang, Siya, Li, Wendi, Liu, Yanjun, Pun, Edwin Y. B., Zentgraf, Thomas, Cheah, Kok W., Luo, Yu, Zhang, Shuang

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Surface modification of additive manufactured components by ultrasonic cavitation abrasive finishing by Tan, Kai Liang, Yeo, Song Huat

“…Results have demonstrated that this technique improves Ra values of as-built Inconel 625 side surfaces by up to 45% after 30 min of processing time. Scanning electron microscopic images revealed that most small-sized partially melted powders were removed through heterogeneous cavitation nucleation on the specimens’ rough initial surface. …”
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Vertically self-ordered orientation of nanocrystalline hexagonal boron nitride thin films for enhanced thermal characteristics by Cometto, Olivier, Sun, Bo, Tsang, Siu Hon, Huang, Xi, Koh, Yee Kan, Teo, Edwin Hang Tong

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Harnessing the Periplasm of Bacterial Cells To Develop Biocatalysts for the Biosynthesis of Highly Pure Chemicals by Yang, Yun, Wu, Yichao, Hu, Yidan, Wang, Hua, Guo, Lin, Fredrickson, James K., Cao, Bin

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Thermodynamics of complexity and pattern manipulation by Vedral, Vlatko, Gu, Mile, Garner, Andrew J. P., Thompson, Jayne

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Achieving secure and privacy-preserving incentive in vehicular cloud advertisement dissemination by Kong, Qinglei, Lu, Rongxing, Zhu, Hui, Ma, Maode

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The recent development and applications of fluidic channels by 3D printing by Zhou, Yufeng

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The Performance and Fouling Control of Submerged Hollow Fiber (HF) Systems: A Review by Akhondi, Ebrahim, Zamani, Farhad, Tng, Keng Han, Leslie, Gregory, Krantz, William B., Fane, Anthony Gordon, Chew, Jia Wei

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Surface enhanced Raman spectroscopy for malaria diagnosis and intradermal measurements by Yuen, Clement, Liu, Quan, Chen, Keren, Ju, Jian, Xiong, Aoli, Preiser, Peter

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Mechanisms of ciliary targeting: entering importins and Rabs by Lu, Lei, Madugula, Viswanadh

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Multifunctional and highly compressive cross-linker-free sponge based on reduced graphene oxide and boron nitride nanosheets by Li, Hongling, Jing, Lin, Tay, Roland Yingjie, Tsang, Siu Hon, Lin, Jinjun, Zhu, Minmin, Leong, Fei Ni, Teo, Edwin Hang Tong

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Ultrasensitive measurement of gas refractive index using an optical nanofiber coupler by Li, Kaiwei, Zhang, Nan, Zhang, Nancy Meng Ying, Liu, Guigen, Zhang, Ting, Wei, Lei

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Temperature and stress distribution in the SOI structure during fabrication by Tan, Cher Ming, Gan, Zhenghao, Gao, Xiaofang

“…Although it is expected that the furnace temperature and withdrawal velocity are the key factors in determining the mechanical stresses, for the present bonding strength of wafers via wafer bonding technology, the withdrawal velocity must be less than 100 mm/min, and under such a withdrawal velocity, the furnace temperature is also an insignificant factor with regard to the induced stress.…”
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System crash as dynamics of complex networks by Yu, Yi, Xiao, Gaoxi, Zhou, Jie, Wang, Yubo, Wang, Zhen, Kurths, Jürgen, Schellnhuber, Hans Joachim

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White light single-shot interferometry with colour CCD camera for optical inspection of microsystems by Upputuri, Paul Kumar, Pramanik, Manojit, Nandigana, Krishna Mohan, Prasad, Mahendra

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Effect of processing parameters on electroless Cu seed layer properties by Chen, Z., Chan, L., See, Alex K. H., Law, S. B., Zeng, K. Y., Shen, L., Tee, K. C., Ee, Elden Yong Chiang

“…Of particular interest is that there exists a preferred Cu (111) crystal orientation in the samples subjected to more than as short as 3 min of deposition. A surface roughness (Rrms) of ∼17 nm has been achieved. …”
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