Rapid defect detections of bonded wafer using near infrared polariscope by Asundi, Anand Krishna, Ng, Chi Seng

Subjects: “…Bonded interface…”
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Bond order resolved 3d 5/2 and valence band chemical shifts of Ag surfaces and nanoclusters by Sun, Changqing, Qin, Wei, Wang, Yan, Huang, Yongli, Zhou, Zhaofeng, Yang, Chao

“…It is clarified that the globally positive energy shifts originate from the undercoordination-induced Goldschmidt–Pauling bond contraction and the associated local quantum entrapment and the heterocoordination-induced bond nature alteration at the particle–substrate interfaces. …”
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Hand gesture design using bionic prosthetic hand. by Leong, Kah Meng, Tan, Tian Swee, Matthias, Tiong Foh Thye, Sheikh, Jahanzeb, Chan, Bun Seng, Nordin, Nur Dalilah, Tan, Jia Hou

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Decoding Surface Touch Typing from Hand-Tracking by Richardson, Mark, Durasoff, Matt, Wang, Robert

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Bond strength of 3D printed concrete by Panda, Biranchi, Tay, Daniel Yi Wei, Ting, Andrew Guan Heng, He, Lewei, Tan, Ming Jen

“…In this paper, the authors investigate the possibility of improving the interface bond strength of this layer by layer construction technique. …”
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Critical temperatures in thermocompression gold stud bonding by Zhang, G. G., Ang, X. F., Chen, Z., Wong, Chee C., Wei, J.

“…This is supported by the observation on the interfacial shear stress distribution at the bonding interface based on finite element simulation models of substrates with different hardness.…”
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Low temperature Cu-Cu thermo-compression bonding with temporary passivation of self-assembled monolayer and its bond strength enhancement by Ang, X. F., Wei, J., Leong, K. C., Tan, Chuan Seng, Lim, Dau Fatt

“…After 3 days of storage, the temporary SAM layer is desorbed with in situ anneal in inert ambient to uncover the clean Cu surface. A pair of wafers is bonded at 250 °C. Clear evidences of in-plane and out-of-plane Cu grain growth are observed resulting in a wiggling bonding interface. …”
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Recognition of human hand gestures and its application to human-robot interaction by Yin, Xiaoming.

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Dynamic fracture mechanics of FRP-concrete interface by Li, Gen

“…Due to the inconsistent deformation in concrete and FRP laminate, relative slip and corresponding shear stress is created between the concrete and FRP and the bond of the interface eventually fails by shear debonding. …”
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Reduction of dimensionality of a cellular actuator array for driving a robotic hand by Cho, Kyu-Jin, Ph. D. Massachusetts Institute of Technology

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Evaluation of process requirements for room temperature direct copper bonding by Chen, Qiang.

“…The ultrathin (1-3 nm) organic monolayer structure, as compared to a bulk oxide layer, could be easily displaced during the mechanical deformation at the bonding interface. Preliminary results have shown copper samples bond even at room temperature with SAMs. …”
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Interface energetics and dynamics in organic-inorganic hybrid perovskites by Goh, Teck Wee

“…This thesis is dedicated to address these issues. Firstly, the interface energetics of FAPbI3-based perovskites with organic charge extraction layers showed apparent upward band bending, but its origin is unexpectedly due to presence of δ-FAPbI3. …”
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Multi-class classification of EEG in a brain-computer interface by Chong, Cherrie Ning Hui

“…The brain-computer interface (BCI) has drawn much interest for its broad potential in clinical applications, to restore motor control and communication ability to the disabled. …”
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Development of a vision-based gesture human-computer interface by Lim, Chun Ping.

“…A human computer interface (HCI) involves information passing between the human and the computer. …”
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Interface engineering for organic−inorganic hybrid perovskite solar cells by Foo, Shini

“…Owing to ionic and soft bonding characteristics of OIHP materials, defects such as under−coordinated ions and dangling bonds tend to concentrate at the OIHP/HTL interface. …”
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Nanomechanical adaptation of early apoptotic cell shrinkage to materials interface by Cai, Pingqiang

“…Based on this, we conducted a systematic evaluation by interfacing cells with substrates specifically engineered (e.g. through substrate elasticity and geometric constraints) to modulate the two factors. …”
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Thermal shock resistance enhancement by improved interfacial bonding for carbon/aluminium composites by Wei, Wenfu, Huang, Zhanglin, Yin, Guofeng, Yang, Zefeng, Li, Xiaobo, Zuo, Haozi, Deng, Qin, Huang, Guizao, Ren, Junwen, Liao, Qianhua, Yang, Yan, Wu, Guangning

“…However, the unstable bonding of the C/Al interface and significant thermal expansion differences have resulted in risks of the composites' failure once suffering from severe thermal shock. …”
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Ultrsonic testing of bond integrity in adhesive joints between 2 similar metals by Ang, Marcus

“…In the presence of a cohesive bond at the adhesive-adherend interface, the A-scan is able to pick up the adhesive signals during ultrasonic testing. …”
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Electrical tunable topological valley photonic crystals for on-chip optical communications in the telecom band by Qi, Zhipeng, Hu, Guohua, Deng, Chunyu, Sun, Hao, Sun, Yaohui, Li, Ying, Liu, Bo, Bai, Yu, Chen, Shuaidong, Cui, Yiping

“…On-chip optical communications are in increasingly demand for low-loss, small-footprint and power-efficient waveguiding solutions in the telecom band. However, most integrated optical circuits suffer from high propagation loss and low integration degree. …”
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Preparation and characterization of apatite/cathode interfaces of solid oxide fuel cells by Heah, Min An.

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