Effects of doping concentration on bond length and bond energy studied by Raman shift by Yang, Xuexian, Dong, Zhili, Sun, Chang Q.

“…Based on the correlation between Raman shift and bond parameters, and further combined with experimental values of the Raman shift composition effect, the relationship between the composition and bond parameters of the 2D-M1−xM′xX2 and 2D-MX′2xX2(1−x) alloy materials was established. …”
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Rhodium-catalysed carbon-carbon bond formation and carbon-sulfur bond functionalisation by Bouisseau, A

“…<p>This thesis documents the development of synthetic methodologies utilising rhodium catalysis for the formation of carbon-carbon bonds and the functionalisation of carbon-sulfur bonds.…”

Ultrasonic bonding of microfluidic devices by Tan, Wei Yung

“…The objective of this study was to find optimal bonding parameters to achieve desirable weld quality in terms of seal appearance and leak-proof sealing with proper microfluidic flow between a micro-mixer and a cover plate. …”
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Analysis of composite bonded joints by Chui, Christopher Shao Liang

“…This parametric study on adhesive bonded composite single lap joints aims to determine the optimum bondline thickness, bond length and dimensions of a hybrid single lap joint, which gives the highest ultimate shear strength under a lap shear test in accordance to ASTM D5868. …”
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Essays on the market for corporate bonds by Levonmaa, A

“…<p>This thesis contains three empirical studies on the US corporate bond market; each chapter is self-contained and can be read independently. …”

Debonding of adhesively bonded composite joints by Murugesh, Sanjay Matthew

“…One of the most common joining techniques used in Design for Assembly to produce cutting-edge technical products with complicated geometries is Adhesive Bonding. In this study, tests were used to investigate the failure characteristics between different types of adhesives. …”
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Development of the bond markets in Singapore and Malaysia. by Chan, Wei Lun.

Subjects: “…DRNTU::Business::Finance::Fixed income::Bonds…”
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Binding and bonding characteristics of silica aerogels by Ong, Jingru.

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Ultrasonic bonding of thermoplastic microfluidic devices by Ngooi, Yaohe.

“…However, good quality micro features and bond strength was observed from the optimised microfluidic devices tested.…”
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Diffusion bonding of superalloys for aerospace applications by Chandel, Roop Singh., Seow, Hong Pheow.

“…The diffusion bonding of Inconel alloy 718 to itself and to 17-4 PH stainless steel has been studied. …”
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Design analysis of adhesively bonded structures by Wong, Ee-Hua, Liu, Johan

“…The existing analytical solutions for the peeling and shearing stresses in polymeric adhesively bonded structures are either too inaccurate or too complex for adoption by practicing engineers. …”
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Investigating rhodium-catalysed hydroacylation and carbon-carbon bond activation by Coxon, T

Subjects: “…C-C Bond Activation…”

Bond strength of 3D printed concrete by Panda, Biranchi, Tay, Daniel Yi Wei, Ting, Andrew Guan Heng, He, Lewei, Tan, Ming Jen

“…Four different time-gap on the bond strength of individual layer was studied and is found that the bond of a shorter time gap yields better strength. …”
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Critical temperatures in thermocompression gold stud bonding by Zhang, G. G., Ang, X. F., Chen, Z., Wong, Chee C., Wei, J.

“…A study on temperature dependence in gold-gold (Au–Au) thermocompression bonding was performed. Gold studs were bonded to two kinds of surfaces—cofired gold on alumina and electroless nickel covered with immersion Au on silicon. …”
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Boon or bane? : The role of filial piety, relationship quality, caregiver gender on work-family interface among working caregivers of the elderly by Leong, Anthony Xueheng

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Low temperature Cu-Cu thermo-compression bonding with temporary passivation of self-assembled monolayer and its bond strength enhancement by Ang, X. F., Wei, J., Leong, K. C., Tan, Chuan Seng, Lim, Dau Fatt

“…This gives rise to enhancement in shear strength in the bonded Cusingle bondCu layer.…”
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Selective catalytic sp3 C–O bond cleavage with C–N bond formation in 3-alkoxy-1-propanols by Chen, Cheng, Hong, Soon Hyeok

“…Based on the experimental results, O-bound and C-bound Ru enolate complexes were proposed as key intermediates for the unique selective sp3 C–O bond cleavage in 3-alkoxy-1-propanols.…”
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C-F bond activation by transient phosphenium dications by Đorđević, Nemanja, Tay, Madelyn Qin Yi, Muthaiah, Senthilkumar, Ganguly, Rakesh, Dimić, Dušan, Vidović, Dragoslav

“…C–F bond cleavage by transient phosphorus(III)-based dications [RP(C(PPh3)2)]2+ (4a2+, R = Ph; 4b2+, R = 4-F-Ph) is reported. …”
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Examination of high strength steel design provisions : bond by Chua, Aye Neng

“…This project aims to provide a comprehensive comparison among seven deterministic bond stress-slip models developed in the past research, and to enhance their applicability by establishing the bond-slip statistical cloud model. …”
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Peptide asparaginyl ligases—renegade peptide bond makers by Tam, James P., Chan, Ning-Yu, Liew, Heng Tai, Tan, Shaun J., Chen, Yu

“…Making peptide bonds is tightly controlled by genetic code and machinery which includes cofactors, ATP, and RNAs. …”
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